R-t-b based permanent magnet and raw alloy for the same
US-2015302959-A1 · Oct 22, 2015 · US
Rare earth metal-based permanent magnet
US9287027B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9287027-B2 |
| Application number | US-99034108-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 14, 2008 |
| Priority date | May 14, 2008 |
| Publication date | Mar 15, 2016 |
| Grant date | Mar 15, 2016 |
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- Title
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Abstract
Official abstract text for this publication.
An objective of the present invention is to provide a rare earth metal-based permanent magnet with improved adhesion properties. A rare earth metal-based permanent magnet of the present invention as a means for achieving the objective has a laminated plating film, and is characterized in that the plating film comprises as an outermost surface layer a SnCu alloy plating film having a film thickness in a range from 0.1 μm to 2 μm, the composition of the SnCu alloy plating film is 35 mass % or more but less than 55 mass % of Sn and the rest being Cu, and a base plating film having two or more layers including at least a Ni plating film and a Cu plating film which are formed as the lower layer under the SnCu alloy plating film, and among the base plating film, the Ni plating film is located just below the SnCu alloy plating film. A joined structure fabricated using the rare earth metal-based permanent magnet of the present invention exhibits favorable initial adhesion strength when combined with a silicone-based adhesive, and is less deteriorated in adhesion strength even after a moisture resistance test.
First claim
Opening claim text (preview).
The invention claimed is: 1. A rare earth metal-based permanent magnet having a laminated plating film, characterized in that the plating film comprises as an outermost surface layer a SnCu alloy plating film having a film thickness in a range from 0.1 μm to 2 μm, the composition of the SnCu alloy plating film is 35 mass % or more but less than 55 mass % of Sn and the rest being Cu, and a base plating film having two or more layers including at least a Ni plating film and a Cu plating film which are formed as the lower layer under the SnCu alloy plating film, and among the base plating film, the Ni plating film is located just below the SnCu alloy plating film. 2. The rare earth metal-based permanent magnet as claimed in claim 1 , wherein the film thickness of the Cu plating film provided as one of the base plating films is in a range from 3 μm to 17 μm. 3. The rare earth metal-based permanent magnet as claimed in claim 1 , wherein the film thickness of the Ni plating film provided as one of the base plating films is in a range from 2 μm to 8 μm. 4. The rare earth metal-based permanent magnet as claimed in claim 1 , characterized in that a chemical conversion treatment film is further provided on the SnCu alloy plating film. 5. The rare earth metal-based permanent magnet as claimed in claim 1 , characterized in that the rare earth metal-based permanent magnet is ring-shaped. 6. A joined structure obtained by joining a rare earth metal-based permanent magnet as claimed in claim 1 with other member via a silicone-based adhesive.
Assignees
Inventors
Classifications
Alloys based on tin · CPC title
Composite [nonstructural laminate] of inorganic material having metal-compound-containing layer and having defined magnetic layer · CPC title
Magnetic layer next to second metal compound-containing layer · CPC title
Alloys based on copper · CPC title
- H01F1/0577Primary
sintered · CPC title
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Frequently asked questions
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- What does patent US9287027B2 cover?
- An objective of the present invention is to provide a rare earth metal-based permanent magnet with improved adhesion properties. A rare earth metal-based permanent magnet of the present invention as a means for achieving the objective has a laminated plating film, and is characterized in that the plating film comprises as an outermost surface layer a SnCu alloy plating film having a film thickn…
- Who is the assignee on this patent?
- Miyao Yukimitsu, Nakamura Tsutomu, Hitachi Metals Ltd
- What technology area does this patent fall under?
- Primary CPC classification H01F1/0577. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Mar 15 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).