Methods and apparatus for cleaning semiconductor wafers

Patent metadata

Field	Value
Publication number	US-9281177-B2
Application number	US-201514736543-A
Country	US
Kind code	B2
Filing date	Jun 11, 2015
Priority date	Jul 5, 2007
Publication date	Mar 8, 2016
Grant date	Mar 8, 2016

Abstract

An apparatus for cleaning a surface of wafer or substrate includes a plate being positioned with a gap to surface of the wafer or substrate, and the plate being rotated around an axis vertical to surface of wafer or substrate. The rotating plate surface facing surface of the wafer or substrate has grooves, regular patterns, and irregular patterns to enhance the cleaning efficiency. Another embodiment further includes an ultra sonic or mega sonic transducer vibrating the rotating plate during cleaning process.

First claim

What we claim is:

1. A method for cleaning a wafer having at least one surface comprising:
holding the wafer;
positioning a plate adjacent the wafer, defining a gap therebetween;
attaching a mechanical wave transducer to the plate causing the plate to vibrate, wherein the mechanical wave transducer is an ultra sonic or mega sonic transducer;
moving the plate and the attached mechanical wave transducer in a direction parallel to the surface of the wafer;
rotating the plate and the mechanical wave transducer to rotate around an axis vertical to the plate, wherein the rotation causes the following condition to be satisfied: a distance d between point A and point O must be smaller than the radius of the plate in the time that the plate rotates π radian, wherein point A is a point on the wafer that overlays with the leading edge of the vibrating plate in the direction of plate movement and point O is the center of the plate;
delivering chemical fluid on the surface of the wafer.

Assignees

• Acm Research Shanghai Inc

Inventors

• Wang Hui
• Wang Jian
• Ma Yue
• He Chuan

Classifications

• H10P72/0411

  for wet cleaning or washing · CPC title

• H10P72/0414 Primary

  using mainly spraying means, e.g. nozzles · CPC title

• H10P70/234

  the processing being the formation of vias or contact holes · CPC title

• H10P70/15

  by wet cleaning only (H10P70/52 takes precedence) · CPC title

• H10P70/00 Primary

  Cleaning of wafers, substrates or parts of devices · CPC title