Heating lamp having base to facilitate reduced air flow about the heating lamp

Patent metadata

Field	Value
Publication number	US-9277595-B2
Application number	US-201313770013-A
Country	US
Kind code	B2
Filing date	Feb 19, 2013
Priority date	Feb 24, 2012
Publication date	Mar 1, 2016
Grant date	Mar 1, 2016

Abstract

Embodiments of heating lamps and heating lamp arrays are disclosed herein. In some embodiments, a heating lamp may include a heating lamp envelope having a filament disposed within the heating lamp envelope; a base coupled to the heating lamp envelope to support the heating lamp envelope; and one or more recesses formed in the base to provide an improved grip for a user. In some embodiments, a heating lamp array for use in a semiconductor process chamber may include a plurality of heating lamps, each heating lamp comprising a heating lamp envelope having a filament disposed within the envelope and a base coupled to the heating lamp envelope to support the envelope, the base having one or more recesses formed in the base to provide an improved grip for a user, wherein a distance between adjacent heating lamp bases is about 0.02 inches to about 0.08 inches.

First claim

The invention claimed is:

1. A heating lamp for use in a semiconductor process chamber, comprising:
a heating lamp envelope having a filament disposed within the heating lamp envelope;
a base having a first surface from which the heating lamp envelope is cantilevered, a second surface parallel to and opposing the first surface, and two third surfaces that are parallel to and oppose each other, the two third surfaces extending between the first surface and the second surface; and
one or more recesses extending into the two third surfaces to provide an improved grip for a user, wherein the one or more recesses have linear axes that are parallel with each other and substantially perpendicular to a primary axis of the heating lamp envelope.

2. The heating lamp of claim 1 , wherein the one or more recesses are two recesses disposed on opposing sides of the base.

3. The heating lamp of claim 1 , wherein the one or more recesses are disposed centrally along the width of the base.

4. The heating lamp of claim 1 , wherein the one or more recesses have a width of about 10 to about 15 mm and a depth of about 0.3 to about 1 mm.

5. The heating lamp of claim 1 , wherein the base has a width of about 43 to about 45 mm, a length of about 25 to about 28 mm, and a thickness of about 43 to about 46 mm.

6. The heating lamp of claim 1 , wherein the base comprises a plurality of fins disposed on, and extending from, at least a portion of one or more sides of the base.

7. The heating lamp of claim 6 , wherein the recesses are disposed at least partially in at least some of the fins.

8. The heating lamp of claim 1 , wherein the base is fabricated from aluminum oxide (Al 2 O 3 ).

9. The heating lamp of claim 1 , wherein the one or more recesses are two recesses formed on opposite sides of the base, wherein the two recesses have respective linear axes that are parallel with each other and substantially perpendicular to a primary axis of the heating lamp extending from the base to a tip of the heating lamp envelope.

10. A heating lamp array for use in a semiconductor process chamber, comprising:
a plurality of heating lamps, each heating lamp comprising a heating lamp envelope having a filament disposed within the heating lamp envelope and a base coupled to the heating lamp envelope to support the heating lamp envelope, the base having one or more recesses formed in the base to provide an improved grip for a user, wherein a distance between adjacent heating lamp bases is about 0.02 inches to about 0.08 inches to create a choked air flow between the adjacent heating lamp bases,
wherein the heating lamp array is circular and each heating lamp envelope extends radially inward.

11. The heating lamp array of claim 10 , further comprising a plurality of sockets disposed in a circular array, wherein respective ones of the plurality of heating lamps are coupled to corresponding ones of the plurality of sockets.

12. The heating lamp array of claim 10 , wherein the one or more recesses are two recesses formed on opposite sides of the base, wherein the two recesses have respective linear axes that are parallel with each other and substantially perpendicular to a primary axis of the heating lamp extending from the base to a tip of the heating lamp envelope.

13. The heating lamp array of claim 10 , wherein the one or more recesses are two recesses disposed on opposing sides of the base.

14. The heating lamp array of claim 10 , wherein the one or more recesses are disposed centrally along the width of the base.

15. The heating lamp array of claim 10 , wherein the one or more recesses have a width of about 10 to about 15 mm and a depth of about 0.3 to about 1 mm.

16. The heating lamp array of claim 10 , wherein the base has a width of about 43 to about 45 mm, a length of about 25 to about 28 mm and a thickness of about 43 to about 46 mm.

17. The heating lamp array of claim 10 , wherein the base comprises a plurality of fins disposed on, and extending from, at least a portion of one or more sides of the base.

18. The heating lamp array of claim 17 , wherein the recesses are disposed at least partially in at least some of the fins.

19. The heating lamp array of claim 10 , wherein the base is fabricated from aluminum oxide (Al 2 O 3 ).

20. A process chamber, comprising:
a chamber body; and
a circular heating lamp array disposed within the chamber body, the heating lamp array comprising a plurality of sockets disposed in a circular array and a plurality of heating lamps respectively coupled to the plurality of sockets, wherein each of the plurality of heating lamps comprises heating lamp envelope having a filament disposed within the heating lamp envelope and a base coupled to the heating lamp envelope to support the heating lamp envelope, the base having one or more recesses formed in the base to provide an improved grip for a user and a plurality of fins disposed on, and extending from, at least a portion of one or more sides of the base, wherein a distance between adjacent heating lamp bases is about 0.02 inches to about 0.08 inches to create a choked air flow between the adjacent heating lamp bases, wherein each heating lamp envelope extends radially inward.

Assignees

• Applied Materials Inc

Inventors

• Myo Nyi Oo

Classifications

• H05B3/0047 Primary

  for semiconductor manufacture · CPC title