Thermally enhanced package with lid heat spreader

Patent metadata

Field	Value
Publication number	US-9269648-B2
Application number	US-201414560678-A
Country	US
Kind code	B2
Filing date	Dec 4, 2014
Priority date	Sep 14, 2012
Publication date	Feb 23, 2016
Grant date	Feb 23, 2016

Abstract

A method and apparatus are provided for manufacturing a lead frame based thermally enhanced package ( 9 ) with exposed heat spreader lid array ( 96 ) designed to be optimized for compression mold encapsulation of an integrated circuit die ( 94 ) by including a perimeter reservoir regions ( 97 r ) in each heat spreader lid ( 96 ) for movement of mold compound ( 98 ) displaced during the mold compression process.

First claim

What is claimed is:

1. A semiconductor package, comprising:
a substrate having first and second surfaces;
a die having first and second surfaces, where the first surface of the die is attached to the first surface of the substrate;
a thermally conductive interface layer located on the second surface of the die; and
a heat spreader lid having a first surface and an exposed heat dissipation surface, the heat spreader lid comprising one or more recess openings formed in the first surface to define a recessed pedestal structure and a peripheral lid feet structure extending between the one or more recess openings and the first surface, where the recessed pedestal structure is positioned for direct attachment to the thermally conductive interface layer, and where the recessed pedestal structure and peripheral lid feet structure define a mold compound cavity in which compression molded compound material is located to seal the substrate and heat spreader lid.

2. The semiconductor package of claim 1 , further comprising an array of solder balls attached to the second surface of the substrate to make electrical connection to the die via conductive traces formed in the substrate.

3. The semiconductor package of claim 1 , where the thermally conductive interface layer comprises a patterned layer of compliant, thermally conductive grease or non-curing silicon material.

4. The semiconductor package of claim 1 , where the heat spreader lid includes a thermally conductive layer of copper, aluminum or an alloy thereof.

5. The semiconductor package of claim 1 , where the peripheral lid feet structure is formed in the heat spreader lid as a recessed lid feet structure disposed peripherally around the recessed pedestal to separate the mold compound cavity from one or more singulation recess openings formed in the heat spreader lid.

6. The semiconductor package of claim 1 , where the mold compound cavity formed in the heat spreader lid provides sufficient space for wire bond conductors attached to the die when the substrate is clamped to the heat spreader lid.

7. The semiconductor package of claim 1 , where the recessed pedestal structure has a thermal contact surface that is at least as large as the second surface of the die.

8. The semiconductor package of claim 1 , where the peripheral lid feet structure extends further from the exposed heat dissipation surface of the heat spreader lid than the recessed pedestal structure.

9. The semiconductor package of claim 1 , where the peripheral lid feet structure extends past the recessed pedestal structure to form a lid feet structure disposed peripherally around the recessed pedestal to provide a thermal conduction path to the substrate.

10. The semiconductor package of claim 1 , where the peripheral lid feet structure extends past the recessed pedestal structure to form a lid feet structure that does not extend to contact the substrate, thereby providing a reservoir opening through which mold compound material flows from the one or more recess openings during compression molding.

11. The semiconductor package of claim 1 , where the peripheral lid feet structure extends past the recessed pedestal structure to form a lid feet structure that contacts the substrate to facilitate compression molding and prevent damage to the die during compression molding.

12. A lead frame heat spread lid array comprising opposing first and second surfaces with a plurality of recess openings formed in the first surface to define:
an outer seal ring structure in the first surface that is formed peripherally around the lead frame heat spread lid array to provide a mold compound seal ring;
an array of pedestal lids recessed from the first surface by a first specified distance, each pedestal lid surrounded by a pedestal recess opening that is recessed from the first surface by a second specified distance that is larger than the first specified distance; and
an array of peripheral extension structures recessed from the first surface by a third specified distance that is smaller than the first specified distance, each peripheral extension structure surrounding a corresponding pedestal recess opening to provide a seal reservoir for overflow mold compound material.

13. The lead frame heat spread lid array of claim 12 , comprising a copper sheet where the plurality of recess openings are machined, stamped, or etched into the copper sheet.

14. The lead frame heat spread lid array of claim 12 , where the outer seal ring structure, array of pedestal lids, and array of peripheral extension structures are formed with a thermally conductive layer of copper, aluminum or an alloy thereof.

15. The lead frame heat spread lid array of claim 12 , further comprising an arrayed pattern of recessed saw singulation recesses formed in each peripheral extension structure.

16. The lead frame heat spread lid array of claim 12 , where each pedestal lid is sized to match a specified size for a die to be attached to the pedestal lid.

17. The lead frame heat spread lid array of claim 12 , where each pedestal lid is sized to be smaller than a specified size for a die to be attached to the pedestal lid.

18. The lead frame heat spread lid array of claim 12 , where each pedestal lid is sized to be larger than a specified size for a die to be attached to the pedestal lid.

19. A semiconductor package, comprising:
a lead frame heat spreader comprising opposing first and second surfaces with one or more recess openings formed in the first surface to define:
a pedestal lid recessed from the first surface by a first specified distance and surrounded by a pedestal recess opening that is recessed from the first surface by a second specified distance that is larger than the first specified distance; and
a peripheral extension structure recessed from the first surface by a third specified distance that is smaller than the first specified distance, the peripheral extension structure surrounding the pedestal recess opening;

a ball grid array substrate;
a die having first and second surfaces, where the first surface of the die is attached to the ball grid array substrate with a plurality of flip chip bumps;
a thermally conductive interface layer located on the second surface of the die to make direct contact between the die and the pedestal lid of the lead frame heat spreader, thereby partially displacing the liquid mold compound into the plurality of recess openings; and
where the pedestal lid and peripheral extension structure define a mold compound cavity in which compression molded compound material is located to seal the ball grid array substrate and lead frame heat spreader.

20. The semiconductor package of claim 19 , where the pedestal lid and peripheral extension structure are formed with a thermally conductive layer of copper, aluminum or an alloy thereof where the one or more recess openings are machined, stamped, or etched into the thermally conductive layer of copper, aluminum or an alloy thereof.

Assignees

• Higgins Iii Leo M
• Freescale Semiconductor Inc

Inventors

• Higgins Iii Leo M

Classifications

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W72/877

  Bump connectors and die-attach connectors · CPC title

• H10W72/865

  Die-attach connectors and bond wires · CPC title