Ag ball, ag core ball, flux-coated ag ball, flux-coated ag core ball, solder joint, formed solder, solder paste and ag paste

Patent metadata

Field	Value
Publication number	US-9266196-B2
Application number	US-201514613256-A
Country	US
Kind code	B2
Filing date	Feb 3, 2015
Priority date	Feb 4, 2014
Publication date	Feb 23, 2016
Grant date	Feb 23, 2016

Abstract

Providing an Ag ball having a low alpha dose and a high sphericity regardless of impurity elements having an amount equal to or more than a predetermined value except for Ag. In order to suppress a soft error and reduce an connection fault, a content of U is equal to or less than 5 ppb, a content of Th is equal to or less than 5 ppb, a purity is equal to or more than 99.9% but equal to or less than 99.9995%, an alpha dose is equal to or less than 0.0200 cph/cm 2 , a content of either Pb or Bi or a total content of both Pb and Bi is equal to or more than 1 ppm, and a sphericity is equal to or more than 0.90.

First claim

What is claimed is:

1. An Ag ball, comprising:
an element U, a content thereof being equal to or less than 5 ppb; and
an element Th, a content thereof being equal to or less than 5 ppb;
wherein a purity of said Ag ball is equal to or more than 99.9% but equal to or less than 99.9995%;
an alpha dose of said Ag ball is equal to or less than 0.0200 cph/cm 2 ;
a content of either Pb or Bi or a total content of both Pb and Bi is equal to or more than 1 ppm; and
a sphericity of said Ag ball is equal to or more than 0.90.

2. The Ag ball as recited in claim 1 , wherein the alpha dose is equal to or less than 0.0010 cph/cm 2 .

3. The Ag ball as recited in claim 1 , wherein a diameter of said Ag ball is 1-1,000 μm.

4. A formed solder characterized in that a plurality of said Ag balls as recited in claim 1 are dispersed in said solder.

5. A solder paste, containing said Ag ball as recited in claim 1 .

6. An Ag paste, containing said Ag ball as recited in claim 1 .

7. A solder joint, using said Ag ball as recited in claim 1 .

8. A flux-coated Ag ball, comprising:
said Ag ball as recited in claim 1 ; and
a flux layer coating said Ag ball.

9. A formed solder characterized in that a plurality of said flux-coated Ag balls as recited in claim 8 are dispersed in the solder.

10. A solder paste, containing a plurality of said flux-coated Ag balls as recited in claim 8 .

11. An Ag paste, containing a plurality of said flux-coated Ag balls as recited in claim 8 .

12. A solder joint, using said flux-coated Ag ball as recited in claim 8 .

13. An Ag core ball, comprising:
said Ag ball as recited in claim 1 : and
a solder layer coating said Ag ball;
wherein said solder layer contains an element U in an amount equal to or less than 5 ppb and further contains an element Th in an amount equal to or less than 5 ppb.

14. The Ag core ball as recited in claim 13 , wherein an alpha dose of said Ag core ball is equal to or less than 0.0200 cph/cm 2 .

15. The Ag core ball as recited in claim 13 , wherein the alpha dose of said Ag core ball is equal to or less than 0.0010 cph/cm 2 .

16. The Ag core ball as recited in claim 13 , wherein a diameter of said Ag core ball is 1-1,000 μm.

17. The Ag core ball as recited in claim 13 , wherein said Ag ball is coated with a layer comprising at least one element selected from Ni and Co within said solder layer.

18. A formed solder including a plurality of said Ag core balls as recited in claim 13 dispersed in the solder.

19. A solder paste, containing a plurality of said Ag core balls as recited in claim 13 .

20. An Ag core paste, containing a plurality of said Ag core balls as recited in claim 13 .

21. A solder joint, using said Ag core ball as recited in claim 13 .

22. A flux-coated Ag core ball, comprising:
said Ag core ball as recited in claim 13 ; and
a flux layer coating said Ag core ball over said solder layer.

23. A formed solder characterized in that a plurality of said flux-coated Ag core balls as recited in claim 22 are dispersed in the solder.

24. A solder paste, containing said flux-coated Ag core ball as recited in claim 22 .

25. An Ag core paste, containing said flux-coated Ag core ball as recited in claim 22 .

26. A solder joint using said flux-coated Ag core ball as recited in claim 22 .

27. The Ag ball as recited in claim 2 , wherein a diameter of said Ag ball is 1-1,000 μm.

28. A formed solder characterized in that a plurality of said Ag balls as recited in claim 2 are dispersed in said solder.

29. A formed solder characterized in that a plurality of said Ag balls as recited in claim 3 are dispersed in said solder.

30. A solder paste, containing said Ag ball as recited in claim 2 .

31. A solder paste, containing said Ag ball as recited in claim 3 .

32. An Ag paste, containing said Ag ball as recited in claim 2 .

33. An Ag paste, containing said Ag ball as recited in claim 3 .

34. A solder joint, using said Ag ball as recited in claim 2 .

35. A solder joint, using said Ag ball as recited in claim 3 .

36. A flux-coated Ag ball, comprising:
said Ag ball as recited in claim 2 ; and
a flux layer coating said Ag ball.

37. A flux-coated Ag ball, comprising:
said Ag ball as recited in claim 3 ; and
a flux layer coating said Ag ball.

38. An Ag core ball, comprising:
said Ag ball as recited in claim 2 and
a solder layer coating said Ag ball;
wherein said solder layer contains an element U in an amount equal to or less than 5 ppb and further contains an element Th in an amount equal to or less than 5 ppb.

39. An Ag core ball, comprising:
said Ag ball as recited in claim 3 and
a solder layer coating said Ag ball;
wherein said solder layer contains an element U in an amount equal to or less than 5 ppb and further contains an element Th in an amount equal to or less than 5 ppb.

Assignees

• Senju Metal Industry Co

Inventors

• AKAGAWA Takashi
• Kawasaki Hiroyoshi
• Matsui Kazuhiko
• Koikeda Yuichi
• Sasaki Masaru
• Yamasaki Hiroyuki
• Roppongi Takahiro
• Soma Daisuke
• Sato Isamu

Classifications

• H10W72/255

  of outermost layers of multilayered bumps, e.g. material of a coating · CPC title

• H10W72/252

  comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu · CPC title

• H10W72/232

  Plan-view shape, i.e. in top view · CPC title

• B22F1/107

  containing organic material comprising solvents, e.g. for slip casting · CPC title

• B22F1/102

  Metallic powder coated with organic material · CPC title