Implementing heat sink loading having multipoint loading with actuation outboard of heatsink footprint

Patent metadata

Field	Value
Publication number	US-9265157-B2
Application number	US-201313796323-A
Country	US
Kind code	B2
Filing date	Mar 12, 2013
Priority date	Mar 12, 2013
Publication date	Feb 16, 2016
Grant date	Feb 16, 2016

Abstract

A method and apparatus are provided for implementing enhanced heat sink loading for cooling an electronic module having one or more semiconductor chips. The apparatus includes an electronic module having one or more semiconductor chips; a heat sink; a heat sink load bearing member further comprising raised points; a load spring passing through the heat sink, the load spring having a latch arm at a first end and a load screw at a second end actuating the load spring, the load spring when actuated is configured to bear against the raised points to equalize pressure distribution over one or more semiconductor chips on the electronic module.

First claim

What is claimed is:

1. An apparatus for implementing enhanced heat sink loading for cooling an electronic module comprising:
an electronic module having multiple semiconductor chips;
a heat sink;
a heat sink load bearing member further comprising raised points;
a load spring passing through the heat sink, said load spring having a latch arm at a first end and a load screw at a second end actuating said load spring, said load spring when actuated bearing against the raised points to equalize pressure distribution over one or more chips on the multiple chip electronic module; and said raised points being positioned over the one or more semiconductor chips to distribute pressure and deflection of a heat sink base with a predefined bearing load, providing improved cooling properties.

2. The apparatus as recited in claim 1 wherein said heat sink includes a heat sink base formed of a highly conductive material.

3. The apparatus as recited in claim 2 wherein said highly conductive material includes aluminum and copper.

4. The apparatus as recited in claim 1 includes highly conductive horizontally extending fins.

5. The apparatus as recited in claim 1 wherein said heat sink includes a predefined heat sink footprint and said load screw at the second end of said load spring enables actuation outboard of said heat sink footprint.

6. The apparatus as recited in claim 1 wherein said load screw is visible to a user operator.

7. The apparatus as recited in claim 1 wherein said load spring includes formed steel features for retaining said load spring.

8. A method for implementing enhanced heat sink loading for cooling a module comprising:
providing an electronic module having multiple semiconductor chips;
providing a heat sink, and a heat sink load bearing member further comprising raised points;
passing a load spring through the heat sink, said load spring adapted to be actuated at both ends, said load spring having a latch arm at a first end and said load spring having a load screw at a second end, and actuating said load spring with said load spring bearing against the raised points to equalize pressure distribution over one or more semiconductor chips on the multiple chip electronic module; and
providing said raised points positioned over the one or more semiconductor chips to distribute pressure and deflection of a heat sink base with a predefined bearing load, providing improved cooling properties.

9. The method as recited in claim 8 includes forming a heat sink base of said heat sink of a highly conductive material.

10. The method as recited in claim 9 wherein said highly conductive material includes aluminum and copper.

11. The method as recited in claim 8 includes providing a stack of highly conductive horizontally extending fins with said heat sink.

12. The method as recited in claim 8 includes providing said load spring with formed steel features for retaining said load spring.

13. The method as recited in claim 8 includes providing said heat sink with a predefined heat sink footprint and locating said load screw at the second end of said load spring outboard of said heat sink footprint.

14. The method as recited in claim 13 includes providing said load screw visible to a user operator.

Assignees

• IBM

Inventors

• Colbert John L
• Eagle Jason R
• Hamilton Roger D

Classifications

• H10W40/611

  Bolts or screws · CPC title

• H10W40/60 Primary

  Securing means for detachable heating or cooling arrangements, e.g. clamps · CPC title

• H05K3/303 Primary

  with surface mounted components (H05K3/32 takes precedence) · CPC title

• Y10T29/49117

  Conductor or circuit manufacturing · CPC title

• H01L2924/0002

  Electricity · mapped topic