Varnish, prepreg, film with resin, metal foil-clad laminate, and printed circuit board

US9265145B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9265145-B2
Application numberUS-201013581009-A
CountryUS
Kind codeB2
Filing dateAug 13, 2010
Priority dateFeb 24, 2009
Publication dateFeb 16, 2016
Grant dateFeb 16, 2016

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The invention provides a varnish produced through reaction between a compound having an amino group and a resin having a functional group capable of reacting with an amino group, and having a polycyclic structure, wherein a portion of a plurality of the functional group of the resin is caused to react with the amino group of the compound in a solvent, and also a varnish produced through reaction between a compound having a phenolic hydroxyl group and a resin having a functional group capable of reacting with a phenolic hydroxyl group, and having a polycyclic structure, wherein a portion of a plurality of the functional group of the resin is caused to react with the phenolic hydroxyl group of the compound in the solvent. The invention also provides a prepreg, a resin-coated film, a metal-foil-clad laminate, and a printed wiring board produced by use of any of the varnishes.

First claim

Opening claim text (preview).

The invention claimed is: 1. A varnish produced through reaction between a compound having an amino group and a resin having a plurality of epoxy groups, and having a polycyclic structure, wherein a portion of the plurality of the epoxy groups of the resin is caused to react with the amino group of the compound in a solvent, wherein the reaction forms a reaction product, and wherein the reaction product has a weight average molecular weight in the range of 800 to 4000, wherein the varnish is produced through reaction between the compound having the amino group and said resin, and between a compound having a phenolic hydroxyl group and said resin, wherein another portion of the plurality of the epoxy groups of the resin is caused to react with the phenolic hydroxyl group of the compound in the solvent, and wherein an amount of the compound having the phenolic hydroxyl group is 0.01 to 100 equivalents on the basis of 1 equivalent of the compound having the amino group. 2. The varnish according to claim 1 , wherein the compound having an amino group is any of guanamine, dicyandiamide, and aminotriazine novolak. 3. The varnish according to claim 1 , wherein the compound having a phenolic hydroxyl group is a phenol novolak resin or a cresol novolak resin. 4. The varnish according to claim 1 , wherein the resin has at least one structure selected from the group consisting of a biphenyl structure, a naphthalene structure, a biphenyl novolak structure, an anthracene structure, and a dihydroanthracene structure. 5. The varnish according to claim 1 , wherein the resin has at least one structure selected from the group consisting of a biphenyl structure, a biphenyl novolak structure, a naphthalene structure, a naphthalene novolak structure, an anthracene structure, and a dihydroanthracene structure. 6. The varnish according to claim 1 , which further includes a solvent for said reaction product.

Assignees

Inventors

Classifications

  • between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

  • Insulating materials thereof · CPC title

  • Die-attach connectors and bond wires · CPC title

  • Polymeric coating · CPC title

  • on fibrous or filamentary layer · CPC title

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Frequently asked questions

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What does patent US9265145B2 cover?
The invention provides a varnish produced through reaction between a compound having an amino group and a resin having a functional group capable of reacting with an amino group, and having a polycyclic structure, wherein a portion of a plurality of the functional group of the resin is caused to react with the amino group of the compound in a solvent, and also a varnish produced through reactio…
Who is the assignee on this patent?
Morita Kouji, Murai Hikari, Takanezawa Shin, and 3 more
What technology area does this patent fall under?
Primary CPC classification H05K1/0346. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Feb 16 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).