Modified silicone compound, and thermosetting resin composition, prepreg, laminate plate and printed wiring board using same
US-11401381-B2 · Aug 2, 2022 · US
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Murai Hikari patents
Murai Hikari holds 4 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 4 |
| Recent patents | 0 |
| First publication | Jul 14, 2015 |
| Latest publication | Aug 2, 2022 |
Filing trend
Year-over-year patent counts for this assignee.
Recent patents
Latest publications where this party is an assignee.
Varnish, prepreg, film with resin, metal foil-clad laminate, and printed circuit board
US-9265145-B2 · Feb 16, 2016 · US
Resin composition, and printed wiring board, laminated sheet, and prepreg using same
US-9133308-B2 · Sep 15, 2015 · US
Prepreg, laminate obtained with the same and printed-wiring board
US-9079376-B2 · Jul 14, 2015 · US
Notable patents
Representative or frequently cited publications from precomputed assignee stats.
Modified silicone compound, and thermosetting resin composition, prepreg, laminate plate and printed wiring board using same
US-11401381-B2 · Aug 2, 2022 · US
Varnish, prepreg, film with resin, metal foil-clad laminate, and printed circuit board
US-9265145-B2 · Feb 16, 2016 · US
Resin composition, and printed wiring board, laminated sheet, and prepreg using same
US-9133308-B2 · Sep 15, 2015 · US
Prepreg, laminate obtained with the same and printed-wiring board
US-9079376-B2 · Jul 14, 2015 · US
Technology areas
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Chemistry & Metallurgy | 4 |
| Electricity | 3 |
| Cross-Sectional Technologies | 3 |
| Operations & Transport | 2 |