Crashworthy memory module having a crack repair system

Patent metadata

Field	Value
Publication number	US-9263358-B2
Application number	US-201414331779-A
Country	US
Kind code	B2
Filing date	Jul 15, 2014
Priority date	Jul 15, 2014
Publication date	Feb 16, 2016
Grant date	Feb 16, 2016

Abstract

A memory module is disclosed. The memory module may have an insulator. The memory module may also have a device disposed within the insulator. The memory module may further have a filler disposed on the device. The filler may be configured to expand and flow into one or more cracks in the insulator, when the filler is subjected to a threshold temperature.

First claim

What is claimed is:

1. A memory module, comprising:
an insulator;
a device disposed within the insulator; and
a filler disposed on the device and configured to expand and flow into one or more cracks in the insulator, when the filler is subjected to a threshold temperature.

2. The memory module of claim 1 , wherein the filler is wrapped around the device.

3. The memory module of claim 2 , wherein the device is disposed in an enclosure in the insulator and the filler has a thickness substantially equal to a width of a gap between the device and walls of the enclosure.

4. The memory module of claim 3 , wherein the filler occupies about 30% to 50% of the enclosure.

5. The memory module of claim 1 , wherein the insulator includes:
a top portion having an upper recess; and
a bottom portion including:
a lower recess; and
a protrusion configured to slidably engage the upper recess.

6. The memory module of claim 5 , wherein
a first filler portion is disposed in the upper recess,
a second filler portion is disposed in the lower recess, and
the device is disposed between the first filler portion and the second filler portion.

7. The memory module of claim 1 , wherein the filler is a thermal clay.

8. The memory module of claim 1 , wherein the threshold temperature ranges from about 250° F. to 370° F.

9. The memory module of claim 1 , wherein the filler has a thermal conductivity of about 0.5 to 2 W/mK.

10. A crack repair system for a device disposed within an insulator, comprising:
a gap extending from an outer surface of the device to one or more walls of the insulator; and
a filler disposed in the gap, the filler being configured to expand and flow into one or more cracks in the one or more walls, when subjected to a threshold temperature.

11. The crack repair system of claim 10 , wherein:
the device is disposed in an enclosure in the insulator;
the filler is wrapped around the device; and
the device and the filler occupy about 50% to 80% of a volume of the enclosure.

12. The crack repair system of claim 10 , wherein:
a first filler portion is disposed on a first side of the device; and
a second filler portion is disposed on a second side of the device opposite the first side.

13. The crack repair system of claim 10 , wherein the threshold temperature is about 250° F. to 370° F.

14. A method of manufacturing a memory module, comprising:
fabricating an insulator having an enclosure;
disposing a filler on a device;
assembling the device in the enclosure, such that when the filler is subjected to a threshold temperature, the filler is configured to expand and flow into one or more cracks in the enclosure.

15. The method of manufacturing of claim 14 , wherein fabricating the insulator further includes:
fabricating a top portion of the insulator; and
fabricating a bottom portion of the insulator.

16. The method of manufacturing of claim 15 , wherein fabricating the top portion further includes:
fabricating an outer upper recess in the top portion; and
fabricating an inner upper recess in the top portion.

17. The method of manufacturing of claim 16 , wherein fabricating the bottom portion further includes:
fabricating a protrusion in the bottom portion; and
fabricating a lower recess in the protrusion.

18. The method of manufacturing of claim 17 , further including:
placing a first filler portion in the inner upper recess;
placing a second filler portion in the lower recess;
placing the device on the second filler portion; and
sliding the protrusion into the outer upper recess.

19. The method of manufacturing of claim 14 , wherein disposing the filler further includes:
wrapping a first strip of the filler around a width of the device; and
wrapping a second strip of the filler around a length of the device.

20. The method of manufacturing of claim 19 , further including:
placing the insulator in a housing base; and
assembling a lid to the housing base.

Assignees

• Progress Rail Services Corp

Inventors

• Bartonek Mark Joseph

Classifications

• H10W76/42

  Fillings · CPC title

• H10W70/692

  Ceramics or glasses · CPC title

• H05K5/021 Primary

  specially adapted for data recorders, e.g. for flight recorders · CPC title

• H01L23/18

  Electricity · mapped topic

• H05K5/062

  sealed by a material injected between a non-removable cover and a body, e.g. hardening in situ · CPC title