Conductive resin composition and chip-type electronic component

Patent metadata

Field	Value
Publication number	US-9263188-B2
Application number	US-95140310-A
Country	US
Kind code	B2
Filing date	Nov 22, 2010
Priority date	Dec 4, 2009
Publication date	Feb 16, 2016
Grant date	Feb 16, 2016

Abstract

A conductive resin composition which allows a resin electrode which is favorable in terms of shape and adhesion to a ceramic device to be formed reliably, and a chip-type electronic component including resin electrodes formed with the conductive resin component are described. The conductive resin composition contains a linear bifunctional epoxy resin having a molecular weight of 11000 to 40000 and a terminal glycidyl group, a conductive silver powder, and a solvent, and has a yield value of 3.6 Pa or less. In addition, the conductive powder can have a surface attached to a fatty acid or a salt thereof, and the ratio of the fatty acid or salt thereof to the conductive powder is 0.5 wt % or less. Furthermore, the conductive powder can be spherical, and the ratio of the conductive powder in solids constituting the conductive resin composition can be 42 to 54 vol %.

First claim

What is claimed is:

1. A thermally cured product of a conductive resin composition comprising:
a linear bifunctional epoxy resin having a molecular weight of 11000 to 40000 and having a glycidyl group at a molecular end; a conductive powder having a silver surface; and a solvent, wherein
the composition has a yield value of 3.6 Pa or less, and
the linear bifunctional epoxy resin is of a type that remains in the conductive resin composition after application to a chip electronic component, drying of the conductive resin composition, and thermally curing the conductive resin composition.

2. A thermally cured product of a conductive resin composition according to claim 1 in which the conductive powder has a surface attached to a fatty acid or a salt thereof, and the amount of the fatty acid or salt thereof to the conductive powder is 0.5 wt % or less.

3. A chip electronic component comprising an electronic component device and an external electrode formed on the electronic component device, wherein the external electrode includes a resin electrode which is the cured product of the conductive resin composition according to claim 2 .

4. A thermally cured product of a conductive resin composition according to claim 1 in which the conductive powder has a surface coated with at least one triazole compound or imidazole compound.

5. The thermally cured product of a conductive resin composition according to claim 4 , wherein the triazole compound is 1-methylbenzotriazole, and the imidazole compound is 2-methylimidazole.

6. A chip electronic component comprising an electronic component device and an external electrode formed on the electronic component device, wherein the external electrode includes a resin electrode which is the cured product of the conductive resin composition according to claim 4 .

7. The thermally cured product of a conductive resin composition according to claim 1 , wherein the conductive powder is spherical, and the amount of the conductive powder solids in the conductive resin composition is 42 to 54 vol %.

8. A chip electronic component comprising an electronic component device and an external electrode formed on the electronic component device, wherein the external electrode includes a resin electrode which is the cured product of the conductive resin composition according to claim 7 .

9. The thermally cured product of a conductive resin composition according to claim 7 , wherein the bifunctional epoxy resin is bisphenol A epoxy resin.

10. A chip electronic component comprising an electronic component device and an external electrode formed on the electronic component device, wherein the external electrode includes a resin electrode which is the cured product of the conductive resin composition according to claim 9 .

11. The thermally cured product of a conductive resin composition according to claim 1 , wherein the solvent is a mixture of two or more solvents, and one solvent has a vapor pressure ≧0.8 mmHg (25° C.) at an amount of 45 wt % or less.

12. A chip electronic component comprising an electronic component device and an external electrode formed on the electronic component device, wherein the external electrode includes a resin electrode which is the cured product of the conductive resin composition according to claim 11 .

13. A chip electronic component comprising an electronic component device and an external electrode formed on the electronic component device, wherein the external electrode includes a resin electrode which is the cured product of the conductive resin composition according to claim 1 .

14. A thermally curable conductive resin composition comprising:
a linear bifunctional epoxy resin having a molecular weight of 11000 to 40000 and having a glycidyl group at a molecular end; a conductive powder having a silver surface; and a solvent, wherein
the composition has a yield value of 3.6 Pa or less,
the linear bifunctional epoxy resin is of a type that remains in the conductive resin composition after application to a chip electronic component, drying of the conductive resin composition, and thermally curing the conductive resin composition,
the conductive powder has a surface attached to a fatty acid or a salt thereof, and the amount of the fatty acid or salt thereof to the conductive powder is 0.5 wt % or less, and
the conductive powder has a surface coated with at least one triazole compound or imidazole compound.

15. The thermally curable conductive resin composition according to claim 14 , wherein the triazole compound is 1-methylbenzotriazole.

16. The thermally curable conductive resin composition according to claim 14 , wherein the conductive powder is spherical, and the amount of the conductive powder solids in the conductive resin composition is 42 to 54 vol %.

17. The thermally curable conductive resin composition according to claim 16 , wherein the bifunctional epoxy resin is bisphenol A epoxy resin.

18. The thermally curable conductive resin composition according to claim 16 , wherein the solvent is a mixture of two or more solvents, and one solvent has a vapor pressure ≧0.8 mmHg (25° C.) at an amount of 45 wt % or less.

19. A chip electronic component comprising an electronic component device and an external electrode formed on the electronic component device, wherein the external electrode includes a resin electrode which is a cured conductive resin composition according to claim 14 .

20. A thermally curable conductive resin composition comprising:
a linear bifunctional epoxy resin having a molecular weight of 11000 to 40000 and having a glycidyl group at a molecular end; a conductive powder having a silver surface; and a solvent, wherein
the composition has a yield value of 3.6 Pa or less,
the linear bifunctional epoxy resin is of a type that remains in the conductive resin composition after application to a chip electronic component, drying of the conductive resin composition, and thermally curing the conductive resin composition,
the conductive powder has a surface attached to a fatty acid or a salt thereof, and the amount of the fatty acid or salt thereof to the conductive powder is 0.5 wt % or less, and
the conductive powder has a surface coated with an imidazole compound and the imidazole compound is 2-methylimidazole.

Assignees

• Otani Shinji
• Nomura Akihiro
• Murata Manufacturing Co

Inventors

• Otani Shinji
• Nomura Akihiro

Classifications

• C08L63/00

  Compositions of epoxy resins; Compositions of derivatives of epoxy resins · CPC title

• H01B1/22

  the conductive material comprising metals or alloys · CPC title

• H01G4/30

  Stacked capacitors (H01G4/33 takes precedence) · CPC title

• H01G4/008 Primary

  Selection of materials · CPC title