Integrated millimeter wave transceiver

Patent metadata

Field	Value
Publication number	US-9257754-B2
Application number	US-201113332031-A
Country	US
Kind code	B2
Filing date	Dec 20, 2011
Priority date	Dec 20, 2010
Publication date	Feb 9, 2016
Grant date	Feb 9, 2016

Abstract

A millimeter wave transceiver including a plate forming an interposer having its upper surface supporting an interconnection network and having its lower surface intended to be assembled on a printed circuit board by bumps; an integrated circuit chip assembled on the upper surface of the interposer; antennas made of tracks formed on the upper surface of the interposer; and reflectors on the upper surface of the printed circuit board in front of each of the antennas, the effective distance between each antenna and the reflector plate being on the order of one quarter of the wavelength, taking into account the dielectric constants of the interposed materials.

First claim

What is claimed is:

1. A millimeter wave transceiver, comprising:
an interposer plate having an upper surface and a lower surface;
an interconnection network supported on the upper surface of the interposer plate;
a printed circuit board having an upper surface and supporting the interposer plate;
bumps coupling the lower surface of the interposer plate to the printed circuit board;
an integrated circuit chip on the upper surface of the interposer plate;
antennas made of tracks formed on the upper surface of the interposer plate;
reflectors corresponding respectively to the antennas and positioned on the upper surface of the printed circuit board, each of the antennas being separated from the corresponding reflector by an effective distance on the order of one quarter of a wavelength of a millimeter wave;
a first conductive track positioned on the upper surface of the interposer and surrounding one of the antennas;
a second conductive track provided on the lower surface of the interposer;
a third conductive track surrounding the reflector corresponding to the antenna surrounded by the first conductive track, the third conductive track being electrically coupled to the second conductive track by the bumps; and
a network of through vias electrically coupling the first and second conductive tracks to each other.

2. The transceiver of claim 1 , wherein the third conductive track is in contact with a peripheral portion of the reflector.

3. The transceiver of claim 1 , wherein the reflector and the conductive tracks are grounded.

4. The transceiver of claim 1 , wherein the bumps are polymer bumps coated with a conductor and with a solder layer.

5. The transceiver of claim 1 , wherein the interposer plate includes a silicon plate.

6. The transceiver of claim 1 , wherein the interposer plate includes a glass plate.

7. The transceiver of claim 1 , comprising an encapsulation resin covering the integrated circuit chip and the interconnection network.

8. A millimeter wave transceiver, comprising:
an interposer plate having an upper surface and a lower surface;
a printed circuit board supporting the interposer plate;
an integrated circuit chip coupled to the interposer plate;
an antenna on the upper surface of the interposer plate;
a reflector on a surface of the printed circuit board and under the antenna;
a first conductive track positioned on the upper surface of the interposer and surrounding one of the antennas;
a second conductive track provided on the lower surface of the interposer;
a third conductive track positioned on the surface of the printed circuit board;
a plurality of connectors electrically coupling the second conductive track to the third conductive track; and
a network of through vias electrically coupling the first and second conductive tracks to each other.

9. The transceiver of claim 8 , wherein the third conductive track is in contact with a peripheral portion of the reflector.

10. The transceiver of claim 8 , wherein the reflector and the conductive tracks are grounded.

11. The transceiver of claim 8 , comprising a plurality of connectors positioned between the interposer and the printed circuit board and configured to space apart the interposer and the printed circuit board from each other.

12. The transceiver of claim 11 , wherein the connectors are polymer bumps coated with a conductor and with a solder layer.

13. The transceiver of claim 8 , wherein the interposer plate includes a silicon plate.

14. The transceiver of claim 8 , wherein the interposer plate includes a glass plate.

15. The transceiver of claim 8 , comprising an encapsulation resin covering the integrated circuit chip and interposer plate.

16. A millimeter wave transceiver, comprising:
a glass or silicon interposer plate having an upper surface and a lower surface;
an interconnection network supported on the upper surface of the interposer plate;
a printed circuit board having an upper surface and supporting the interposer plate;
bumps coupling the lower surface of the interposer plate to the printed circuit board;
an integrated circuit chip on the upper surface of the interposer plate;
antennas made of tracks formed on the upper surface of the interposer plate;
reflectors corresponding respectively to the antennas and positioned on the upper surface of the printed circuit board, each of the antennas being separated from the corresponding reflector by an effective distance on the order of one quarter of a wavelength of a millimeter wave;
a first conductive track positioned on the upper surface of the interposer and surrounding one of the antennas;
a second conductive track provided on the lower surface of the interposer;
a third conductive track surrounding the reflector corresponding to the antenna surrounded by the first conductive track, the third conductive track being electrically coupled to the second conductive track by the bumps; and
a network of through vias electrically coupling the first and second conductive tracks to each other.

17. The millimeter wave transceiver of claim 16 , wherein the third conductive track is in contact with a peripheral portion of the reflector.

18. The millimeter wave transceiver of claim 16 , wherein the antennas form a phased array.

19. The millimeter wave transceiver of claim 16 , wherein the reflector and the conductive tracks are grounded.

20. The millimeter wave transceiver of claim 16 further comprising a plurality of connectors positioned between the interposer and the printed circuit board and configured to space apart the interposer and the printed circuit board from each other.

Assignees

• Carpentier Jean-Francois
• Pruvost Sebastien
• Garcia Patrice
• Busson Pierre
• Dautriche Pierre
• St Microelectronics Sa

Inventors

• Carpentier Jean-Francois
• Pruvost Sebastien
• Garcia Patrice
• Busson Pierre
• Dautriche Pierre

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W74/117

  the substrate having spherical bumps for external connection · CPC title

• H10W72/253

  not comprising solid metals or solid metalloids, e.g. polymers or ceramics · CPC title

• H10W72/223

  characterised by the structure of the outermost layers, e.g. multilayered coatings · CPC title

• H10W44/248

  for antennas · CPC title