Epoxy resin composition and light-emitting device package comprising the same

Patent metadata

Field	Value
Publication number	US-9257621-B2
Application number	US-201414467993-A
Country	US
Kind code	B2
Filing date	Aug 25, 2014
Priority date	Sep 10, 2013
Publication date	Feb 9, 2016
Grant date	Feb 9, 2016

Abstract

An epoxy resin composition according to an embodiment of the present invention comprises an epoxy resin, 0.05-190 parts by weight, based on 10 parts by weight of the epoxy resin, of a polyester-based curing agent, wherein the epoxy resin comprises a triazine derivative epoxy compound and a siloxane compound containing an alicyclic epoxy group and a siloxane group.

First claim

What is claimed is:

1. An epoxy resin composition comprising: an epoxy resin; and 0.05-190 parts by weight, based on 10 parts by weight of the epoxy resin, of a curing agent, wherein the epoxy resin comprises a triglycidylisocyanurate (TGIC) and a siloxane compound containing an alicyclic epoxy group and a siloxane group,
wherein the curing agent comprises a compound of the following formula:

wherein R7 to R16 is each independently selected from H, Cl, Br, F, C1-C3 alkyl, C2-C3 alkene, and C2-C3 alkyne; and n is an integer ranging from 1 to 3.

2. The epoxy resin composition of claim 1 , wherein the siloxane compound comprises a compound represented by the following formula:
Epoxycycloalkyl-CH 2 O—CO-hydroxycycloalkyl-OSiR 1 R 2 O—(SiR 3 R 4 O) n -SiR 5 R 6 O-hydroxycycloalkyl-CO—CH 2 O-epoxycycloalkyl

wherein R 1 to R 6 is each independently selected from H, Cl, Br, F, C 1 -C 3 alkyl, C 2 -C 3 alkene, and C 2 -C 3 alkyne; n is a positive integer; and the cycloalkyl in the epoxycycloalkyl or the hydroxycycloalkyl is a cycloalkyl group having 5 to 20 carbon atoms.

3. The epoxy resin composition of claim 2 , wherein the siloxane compound comprises a compound of the following formula:

wherein R 1 to R 6 may be each independently selected from H, Cl, Br, F, C 1 -C 3 alkyl, C 2 -C 3 alkene, and C 2 -C 3 alkyne; and n is a positive integer.

4. The epoxy resin composition of claim 1 , wherein the siloxane compound is contained in an amount of 10-50 wt % based on the weight of the epoxy resin.

5. The epoxy resin composition of claim 1 , wherein the curing agent comprises a compound of the following formula:

wherein n is an integer ranging from 1 to 3.

6. The epoxy resin composition of claim 1 , wherein the siloxane group is contained in an amount of 10-70 wt % based on the weight of the siloxane compound.

7. The epoxy resin composition of claim 6 , wherein the siloxane group is contained in an amount of 30-60 wt % based on the weight of the siloxane compound.

8. The epoxy resin composition of claim 1 , wherein the epoxy resin composition further comprises an inorganic filler, and the inorganic filler comprises TiO 2 -impregnated SiO 2 .

9. The epoxy resin composition of claim 8 , wherein the TiO 2 -impregnated SiO 2 is contained in an amount of 20-35 wt % based on the weight of the epoxy resin composition.

10. The epoxy resin composition of claim 9 , wherein the TiO 2 -impregnated SiO 2 is contained in an amount of 25-35 wt % based on the weight of the epoxy resin composition.

11. A light-emitting device package comprising: a molded body; and a light-emitting device mounted in the molded body; the molded body comprising an epoxy resin composition comprising: an epoxy resin; 0.05-190 parts by weight, based on 10 parts by weight of the epoxy resin, of a curing agent, wherein the epoxy resin comprises a triglycidylisocyanurate (TGIC) and a siloxane compound containing an alicyclic epoxy group and a siloxane group,
wherein the curing agent comprises a compound of the following formula:

wherein R7 to R16 is each independently selected from H, Cl, Br, F, C1-C3 alkyl, C2-C3 alkene, and C2-C3 alkyne; and n is an integer ranging from 1 to 3.

12. The light-emitting device package of claim 11 , further comprising a molding member surrounding the light-emitting device, wherein the molding member comprises an epoxy resin composition comprising: an epoxy resin; 0.05-190 parts by weight, based on 10 parts by weight of the epoxy resin, of the curing agent, wherein the epoxy resin comprises a triglycidylisocyanurate (TGIC) and a siloxane compound containing an alicyclic epoxy group and a siloxane group.

13. The light-emitting device package of claim 11 , wherein the epoxy resin composition further comprises an inorganic filler, and the inorganic filler comprises TiO 2 -impregnated SiO 2 .

Assignees

• Lg Innotek Co Ltd

Inventors

• Moon Sungbae
• Jeong Jaehun
• Lee Mi Jin
• Lee Soomin
• Lee Yuwon

Classifications

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10H20/854 Primary

  characterised by their material, e.g. epoxy or silicone resins · CPC title

• C08G59/38

  together with di-epoxy compounds · CPC title

• C08G59/4223

  aromatic · CPC title