Multilayer ceramic capacitor and method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-9524826-B2
Application number	US-201414337017-A
Country	US
Kind code	B2
Filing date	Jul 21, 2014
Priority date	Apr 21, 2014
Publication date	Dec 20, 2016
Grant date	Dec 20, 2016

Abstract

A multilayer ceramic capacitor may include a capacitance forming layer including dielectric layers and internal electrodes disposed on the dielectric layers; a lower cover layer disposed below the capacitance forming layer; an upper cover layer disposed above the capacitance forming layer; and a plurality of crack inducing air gaps disposed in the lower cover layer.

First claim

What is claimed is:

1. A multilayer ceramic capacitor comprising:
a capacitance forming layer including dielectric layers and internal electrodes disposed on the dielectric layers;
a lower cover layer disposed below the capacitance forming layer;
an upper cover layer disposed above the capacitance forming layer; and
a plurality of crack inducing air gaps disposed in the lower cover layer,
wherein the crack inducing air gaps are disposed to be tapered from the capacitance forming layer to a lower surface of the lower cover layer.

2. The multilayer ceramic capacitor of claim 1 , wherein a thickness of the lower cover layer is thicker than that of the upper cover layer.

3. The multilayer ceramic capacitor of claim 1 , further comprising external electrodes covering portions of the lower cover layer and the capacitance forming layer and electrically connected to the internal electrodes,
wherein the crack inducing air gaps are disposed to be tapered from the capacitance forming layer to edge portions of the external electrodes formed extendedly on the lower cover layer.

4. The multilayer ceramic capacitor of claim 1 , wherein the crack inducing air gaps are disposed to induce cracks occurring due to impacts to propagate to end surfaces of the lower cover layers.

5. The multilayer ceramic capacitor of claim 1 , wherein the crack inducing air gaps are disposed as a plurality thereof in a linear manner or linearly as a plurality thereof in a disconnected manner in the lower cover layer.

6. A multilayer ceramic capacitor comprising:
first dielectric layers on which a first internal electrode is disposed;
second dielectric layers on which a second internal electrode is disposed;
a ceramic body in which the first and second dielectric layers are alternately stacked;
first crack inducing air gaps formed to be spaced apart from the first internal electrodes and in the first dielectric layers, respectively; and
second crack inducing air gaps formed to be spaced apart from the second internal electrodes and in the second dielectric layers, respectively.

7. The multilayer ceramic capacitor of claim 6 , wherein the first crack inducing air gaps are disposed to induce cracks occurring due to impacts to propagate in a direction in which the cracks propagate so as to be spaced apart from the first internal electrodes.

8. The multilayer ceramic capacitor of claim 6 , wherein the second crack inducing air gaps are disposed to induce cracks occurring due to impacts to propagate in a direction in which the cracks propagate so as to be spaced apart from the second internal electrodes.

9. The multilayer ceramic capacitor of claim 6 , further comprising:
a first external electrode disposed on an end surface of the ceramic body and electrically connected to the first internal electrodes; and
a second external electrode disposed on a surface of the ceramic body opposing the surface on which the first external electrode is disposed, and electrically connected to the second internal electrodes,
wherein the first crack inducing air gaps are disposed to induce cracks propagating from the second external electrode to propagate in a direction in which the cracks propagate so as to be spaced apart from the first internal electrodes.

10. The multilayer ceramic capacitor of claim 6 , further comprising:
a first external electrode disposed on an end surface of the ceramic body and electrically connected to the first internal electrodes; and
a second external electrode disposed on a surface of the ceramic body opposing the surface on which the first external electrode is disposed, and electrically connected to the second internal electrodes,
wherein the second crack inducing air gaps are disposed to induce cracks propagating from the first external electrode in a direction in which the cracks propagate so as to be spaced apart from the second internal electrodes.

11. The multilayer ceramic capacitor of claim 6 , wherein the first crack inducing air gaps are disposed as a plurality thereof in a linear manner or linearly as a plurality thereof in a disconnected manner in the first dielectric layers, and
the second crack inducing air gaps are disposed as a plurality thereof in a linear manner or linearly as a plurality thereof in a disconnected manner in the second dielectric layers.

12. The multilayer ceramic capacitor of claim 6 , wherein the first and second crack inducing air gaps are extended outwardly from a capacitance forming layer including the first and second internal electrodes and the first and second dielectric layers to a bottom surface of the ceramic body through a lower cover layer disposed below the capacitance forming layer.

13. A multilayer ceramic capacitor comprising:
first dielectric layers on which first and second internal electrodes are disposed;
second dielectric layers on which a float electrode is formed, the float electrodes being overlapped with portions of the first and second internal electrodes, respectively; and
crack inducing air gaps formed to be spaced apart from the first and second internal electrodes and in the first dielectric layers, respectively.

14. The multilayer ceramic capacitor of claim 13 , wherein the crack inducing air gaps are disposed to induce cracks passing through the float electrodes to be spaced apart from the first and second internal electrodes.

15. The multilayer ceramic capacitor of claim 13 , wherein the crack inducing air gaps are disposed as a plurality thereof in a linear manner or linearly as a plurality thereof in a disconnected manner in the first dielectric layers.

16. The multilayer ceramic capacitor of claim 13 , wherein the crack inducing air gaps are extended outwardly from a capacitance forming layer including the first and second internal electrodes, the float electrodes, and the first and second dielectric layers, to a bottom surface of a ceramic body, through a lower cover layer disposed below the capacitance forming layer.

Assignees

• Samsung Electro Mech

Inventors

• Choi Woo Jin

Classifications

• H01G4/012

  Form of non-self-supporting electrodes · CPC title

• H01G4/30

  Stacked capacitors (H01G4/33 takes precedence) · CPC title

• H01G2/14 Primary

  Protection against electric or thermal overload (by cooling H01G2/08) · CPC title

• H01G4/12

  Ceramic dielectrics {(H01G4/085 takes precedence)} · CPC title

• H01G4/1227

  based on alkaline earth titanates · CPC title