Data storage medium and method for high density data storage

Patent metadata

Field	Value
Publication number	US-9255182-B2
Application number	US-5644608-A
Country	US
Kind code	B2
Filing date	Mar 27, 2008
Priority date	Aug 31, 2006
Publication date	Feb 9, 2016
Grant date	Feb 9, 2016

Abstract

A composition of matter for a recording medium in atomic force data storage devices. The composition includes polyimide oligomers having covalently bonded monomers forming a backbone, the oligomer thermally stable to at least 400° C.; one or more covalent bonding cross-linking moieties incorporated into the polyimide oligomer; and one or more hydrogen bonding cross-linking moieties incorporated into the polyimide oligomer. The covalent and hydrogen bonding cross-linking of the polyimide oligomers may be tuned to match thermal and force parameters required in read-write-erase cycles.

First claim

What is claimed is:

1. A composition of matter, comprising:
polyimide oligomers comprising covalently bonded monomers, said monomers forming a backbone, said polyimide oligomers thermally stable to at least 400° C.;
one or more covalent bonding cross-linking moieties incorporated into said polyimide oligomers;
one or more hydrogen bonding cross-linking moieties incorporated into said polyimide oligomers; and
wherein (i) said covalent bonding cross-linking moieties are located along said backbone and have the structure:

or
(ii) said covalent bonding cross-linking moieties are located at terminal ends of said backbone and have the structure:

or
(iii) said composition further including a reactive diluent.

2. A method, comprising:
pushing a probe, heated to at least 100° C., into a cross-linked resin layer formed by curing a layer of a composition comprising:
polyimide oligomers comprising covalently bonded monomers, said monomers forming a backbone, said polyimide oligomers thermally stable to at least 400° C.;
one or more covalent bonding cross-linking moieties incorporated into said polyimide oligomers;
one or more hydrogen bonding cross-linking moieties incorporated into said polyimide oligomers;
wherein (i) said covalent bonding cross-linking moieties are located along said backbone and have the structure:

or
(ii) said covalent bonding cross-linking moieties are located at terminal ends of said backbone and have the structure:

or
(iii) said composition further including a reactive diluent, wherein said polyimide oligomers are covalently cross-linked by reactive diluent groups derived from said reactive diluent during said curing; and

removing said probe from said resin layer, resulting in formation of a deformed region in said resin layer.

3. The method of claim 2 , wherein after said curing, said resin layer is cross-linked by said covalent bonding cross-linking moieties.

4. The method of claim 2 further including:
bringing said thermal-mechanical probe into proximity with said cross-linked resin layer multiple times to induce multiple deformed regions at points in said resin layer to write information in said resin layer.

5. The method of claim 4 , further including:
bringing said thermal-mechanical probe into proximity with said points in said resin layer to read said information.

6. The method of claim 5 , further including:
bringing said thermal-mechanical probe into proximity with one or more of said deformed regions in said resin layer, said thermal mechanical probe heating said one or more of said deformed regions to above about 100° C. to deform said one or more of said deformed regions in such a way as to eliminate said one or more deformed regions to erase said information.

7. The method of claim 6 , further including:
repeatedly writing, reading and erasing information at said points in said resin layer.

8. The method of claim 2 , wherein said one or more hydrogen bonding cross-linking moieties are located along said backbone.

9. The method of claim 2 , wherein said one or more hydrogen bonding cross-linking moieties are selected from the group consisting of

and moieties derived from imidazolyl, pyrazolyl, pyrazinyl, pyrimidinyl, pyridazinyl indazoyl, purinyl, phthalazinyl, naphthyridinyl, quinoxalinyl, quinazolinyl, 1,2,3-triazolyl, 1,2,4-triazolyl thiazolyl, isothiazolyl 1,3,5-triazinyl, 1,2,4-triazinyl, 1,2,3-triazinyl, pyrido[3,4-b]-pyridinyl, pyrido[3,2-b]-pyridinyl, pyrido[4,3-b]pyridinyl, purinyl, cinnolinyl, pteridinyl, beta-carbolinyl, phenazinyl, 1,7-phenanthrolinyl, 1,10-phenanthrolinyl, 4,7-phenanthrolinyl, phenarsazinyl, isothiazolyl, thienyl, and thianthrenyl imide.

10. The method of claim 2 , whereon said one or more hydrogen bonding cross-linking moieties are located at terminal ends of said backbone.

11. The method of claim 10 , wherein said one or more hydrogen bonding cross-linking moieties are selected from the group consisting of

moieties derived from 3,5-diamino-1,2,4-triazole, 2,6-diaminopurine, 2,6-diamino-8-purinol, 2,3-diaminopyridine, unsaturated heterocyclic diamines derived by reduction of 2-amino-6-nitrobenzothiazole, 2-amino-5-(4-nitrophenylsulfonyl)thiazole, 2-amino-5-nitropyrimidine, 2-amino-5-nitrothiazole, or 3-amino-4-pyrazole carbonitrile, and moieties derived from ammonia amination of 2-amino-5-bromopyrimidine, 2-amino-5-bromothiazole, 2-amino-4-chlorobenzothiazole, 2-amino-6-chlorobenzothiazole, 2-amino-4-(4-chlorophenyl)thiazole, 2-amino-6-chloropurine, or 2-amino-6-fluorobenzothiazole.

12. The method of claim 2 , wherein said reactive diluent is selected from the group consisting of consisting of:

and
where R 1 , R 2 and R 3 are each independently selected from the group consisting of hydrogen, alkyl groups, aryl groups, cycloalkyl groups, alkoxy groups, aryloxy groups, alkylamino groups, arylamino groups, alkylarylamino groups, and arylthio, alkylthio groups.

13. The method of claim 2 , including:
pushing said probe heated to at least 100° C. into said cross-linked resin layer multiple times to induce multiple deformed regions at points in said resin layer to write information in said resin layer.

14. A method, comprising:
pushing a probe, heated to at least 100° C., into a cross-linked resin layer formed by curing a layer of oligomers;
removing said probe from said resin layer, resulting in formation of a deformed region in said resin layer; and
wherein said oligomers having the structure:

wherein R′ is selected from the group consisting of

wherein at least one R″ group is selected from a first group consisting of:

wherein at least one R″ group is a hydrogen bonding cross-linking moiety selected from a second group consisting of:

and moieties derived from imidazolyl, pyrazolyl, pyrazinyl, pyrimidinyl, pyridazinyl idazoyl, purinyl, phthalazinyl, naphthyridinyl, quinoxalinyl, quinazolinyl, 1,2,3-triazolyl, 1,2,4-triazolyl thiazolyl, isothiazolyl 1,3,5-triazinyl, 1,2,4-triazinyl, 1,2,3-triazinyl, pyrido[3,4-b]-pyridinyl, pyrido[3,2-b]-pyridinyl, pyrido[4,3-b]pyridinyl, purinyl, cinnolinyl, pteridinyl, beta-carbolinyl, phenazinyl, 1,7-phenanthrolinyl, 1,10-phenanthrolinyl, 4,7-phenanthrolinyl, phenarsazinyl, isothiazolyl, thienyl, and thianthrenyl imide;

wherein all R′ groups are selected from sa

Assignees

• Duerig Urs T
• Frommer Jane Elizabeth
• Gotsmann Bernd Walter
• Hagberg Erik Christopher
• Hedrick James Lupton
• Knoll Armin W
• Magbitang Teddie Peregrino
• Miller Robert Dennis
• Pratt Russell Clayton
• Wade Charles Gordon
• IBM

Inventors

• Duerig Urs T
• Frommer Jane Elizabeth
• Gotsmann Bernd Walter
• Hagberg Erik Christopher
• Hedrick James Lupton
• Knoll Armin W
• Magbitang Teddie Peregrino
• Miller Robert Dennis
• Pratt Russell Clayton
• Wade Charles Gordon

Classifications

• C08G73/1085 Primary

  Polyimides with diamino moieties or tetracarboxylic segments containing heterocyclic moieties · CPC title

• C08G73/1064

  containing sulfur · CPC title

• C08G73/101

  containing chain terminating or branching agents · CPC title