Laser and plasma etch wafer dicing with partial pre-curing of UV release dicing tape for film frame wafer application

Patent metadata

Field	Value
Publication number	US-9252057-B2
Application number	US-201314052085-A
Country	US
Kind code	B2
Filing date	Oct 11, 2013
Priority date	Oct 17, 2012
Publication date	Feb 2, 2016
Grant date	Feb 2, 2016

Abstract

Methods and systems of laser and plasma etch wafer dicing using UV-curable adhesive films. A method includes forming a mask covering ICs formed on the wafer. The semiconductor wafer is coupled to a film frame by a UV-curable adhesive film. A pre-cure of the UV-curable adhesive film cures a peripheral portion of the adhesive extending beyond an edge of the wafer to improve the exposed adhesive material's resistance to plasma etch and reduce hydrocarbon redeposition within the etch chamber. The mask is patterned by laser scribing to provide a patterned mask with gaps. The patterning exposes regions of the semiconductor wafer, below thin film layers from which the ICs are formed. The semiconductor wafer is plasma etched through the gaps in the patterned mask to singulate the ICs. A center portion of the UV-curable adhesive is then cured and the singulated ICs detached from the film.

First claim

What is claimed is:

1. A method of dicing a semiconductor wafer comprising a plurality of integrated circuits, the method comprising:
forming a mask above the semiconductor wafer, the mask covering and protecting the integrated circuits;
coupling the semiconductor wafer to a film frame with an ultra-violet (UV)-curable adhesive film;
pre-curing a peripheral portion of the adhesive film disposed beyond an edge of the semiconductor wafer, wherein the adhesive film is transmissive of UV light and wherein the pre-curing comprises:
masking a center portion of the adhesive film to protect the center portion from UV exposure during the pre-curing of the peripheral portion; and
irradiating the peripheral portion of the adhesive film with UV light originating from a backside of the adhesive film, at least some of the UV light passing through the adhesive film on which the peripheral portion of the adhesive film is disposed;

patterning the mask with a laser scribing process to provide a patterned mask with gaps, exposing regions of the semiconductor wafer between the integrated circuits; and
subsequent to pre-curing the peripheral portion of the adhesive film, etching the semiconductor wafer through the gaps in the patterned mask to form singulated integrated circuits while the semiconductor wafer is affixed to the adhesive film.

2. The method of claim 1 , wherein masking the center portion further comprises disposing a UV barrier having a dimension approximately equal to that of the semiconductor wafer adjacent to the backside of the adhesive film in alignment with the semiconductor wafer.

3. The method of claim 2 , wherein the UV barrier further comprises a dummy wafer of a same diameter as the semiconductor wafer.

4. The method of claim 3 , wherein the semiconductor wafer and the dummy wafer are silicon, have a thickness approximately in a range of 100-600 μm, and are between 300 and 450 mm in diameter.

5. The method of claim 1 , further comprising:
curing a center portion of the adhesive film disposed within the edge of the semiconductor wafer by exposure to UV light; and
detaching the singulated integrated circuits from the cured adhesive film.

6. The method of claim 1 , wherein the UV-curable adhesive film comprises at least one acrylic-based adhesive disposed on a polyvinyl chloride film.

7. The method of claim 1 , wherein coupling the semiconductor wafer to a film frame with an ultra-violet (UV)-curable adhesive film further comprises:
contacting the adhesive film to the film frame;
aligning the semiconductor wafer to the film frame; and
contacting the semiconductor wafer to the adhesive film.

8. The method of claim 1 , wherein patterning the mask with the laser scribing process comprises patterning with a femtosecond-based laser scribing process, and wherein etching the semiconductor wafer through the gaps in the patterned mask comprises using a high density plasma etching process.

9. The method of claim 7 , wherein using a high density plasma etching process comprises:
disposing the film frame on a support surrounding a chuck disposed in an etch process chamber;
clamping the semiconductor wafer to the chuck;
plasma etching the semiconductor wafer through the gaps in the patterned mask while disposed on the chuck; and
unclamping the semiconductor wafer.

10. A method of dicing a plurality of integrated circuits, the method comprising:
coupling a masked crystalline silicon substrate to a film frame with a UV-curable adhesive film, a mask covering and protecting integrated circuits disposed on the silicon substrate;
pre-curing a peripheral portion of the adhesive film disposed beyond an edge of the silicon substrate, wherein the adhesive film is transmissive of UV light, and wherein the pre-curing comprises:
masking the center portion of the adhesive film to protect the center portion from UV exposure; and
irradiating the peripheral portion of the adhesive film with UV light originating from a backside of the adhesive film, at least some of the UV light passing through the adhesive film on which the peripheral portion of the adhesive film is disposed;

patterning the mask, at least a layer of silicon dioxide, a layer of low K material, and a layer of copper with a laser scribing process to expose regions of the silicon substrate between the integrated circuits;
subsequent to pre-curing the peripheral portion of the adhesive film, etching the silicon substrate through the exposed regions to form singulated integrated circuits;
curing a center portion of the adhesive film disposed within the edge of the silicon substrate by exposure to UV light; and
detaching the singulated integrated circuits from the cured adhesive film.

11. The method of claim 10 , further comprising forming the mask above the silicon substrate before the silicon substrate is coupled to the film frame.

12. The method of claim 10 , further comprising:
re-irradiating the UV-curable adhesive film with UV light originating from the backside of the adhesive film, curing the center portion of the adhesive film disposed within the edge of the silicon substrate.

13. The method of claim 12 , further comprising:
subsequent to etching the silicon substrate and prior to re-irradiating the UV-curable adhesive film, removing the mask.

14. The method of claim 10 , wherein patterning the mask, the layer of silicon dioxide, the layer of low K material, and the layer of copper with the laser scribing process comprises patterning with a femtosecond-based laser scribing process, and wherein etching the silicon substrate through the exposed regions comprises using a high density plasma etching process.

15. A system for dicing a semiconductor wafer comprising a plurality of integrated circuits (ICs), the system comprising:
a deposition chamber to form a mask above the semiconductor wafer, the mask covering and protecting the ICs;
an adhesive film applicator to couple the semiconductor wafer to a film frame with an ultra-violet (UV)-curable adhesive film;
a curing station to pre-cure a peripheral portion of the adhesive film disposed beyond an edge of the semiconductor wafer, wherein the curing station is to further mask a center portion of the adhesive film to protect the center portion from UV exposure during the pre-curing of the peripheral portion;
a laser scribe module to pattern the mask with a laser scribing process to provide a patterned mask with gaps, exposing regions of the semiconductor wafer between the integrated circuits; and
a plasma etch chamber to etch the semiconductor wafer through the gaps in the patterned mask to form singulated integrated circuits while the semiconductor wafer is affixed to the adhesive film.

16. The system of claim 15 , wherein the curing station is to irradiate the peripheral portion of the adhesive film with UV light originating from a backside of the adhesive film, at least some of the UV light passing through the adhesive film on which the peripheral portion of the adhesive film is disposed before etching the semiconductor wafer.

Assignees

• Applied Materials Inc

Inventors

• Chowdhury Mohammad Kamruzzaman
• Lei Wei-Sheng
• Egan Todd
• Eaton Brad
• Yalamanchili Madhava Rao
• Kumar Ajay

Classifications

• H10P72/7422

  used to protect an active side of a device or wafer · CPC title

• H10P72/7416

  used during dicing or grinding · CPC title

• H10P72/744

  Details of chemical or physical process used for separating the auxiliary support from a device or a wafer · CPC title

• H10P72/742

  involving stretching of the auxiliary support post dicing · CPC title

• H10P72/7402

  Wafer tapes, e.g. grinding or dicing support tapes · CPC title