Conductive resin composition and multilayer ceramic capacitor having the same

Patent metadata

Field	Value
Publication number	US-9251956-B2
Application number	US-201213558098-A
Country	US
Kind code	B2
Filing date	Jul 25, 2012
Priority date	May 4, 2012
Publication date	Feb 2, 2016
Grant date	Feb 2, 2016

Abstract

There is provided a conductive resin composition including epoxy resin, copper powder particles, and non-nitrogen-based hardeners.

First claim

What is claimed is:

1. A conductive resin composition, comprising:
epoxy resin;
copper (Cu) powder particles;
non-nitrogen-based hardeners; and
additives for necking formation,
wherein the additives for the necking formation are reducing agents, conductive properties imparting agents, and organic complexes.

2. The conductive resin composition of claim 1 , wherein the epoxy resin is added in an amount of 7.5 to 20 wt % based on an amount of copper powder.

3. The conductive resin composition of claim 1 , wherein surfaces of the copper powder particles are coated with silver (Ag).

4. The conductive resin composition of claim 1 , wherein the non-nitrogen-based hardener is at least one of active esters of onium salts, sulfonium salts, phosphonium salts, and polyvalent carbonic acid.

5. The conductive resin composition of claim 1 , wherein the non-nitrogen-based hardener is a phenolic hardener.

6. The conductive resin composition of claim 1 , wherein the non-nitrogen-based hardener is an anhydride hardener.

7. The conductive resin composition of claim 1 , wherein the reducing agent is at least one of ascorbic acid, sodium borohydride, formic acid, oxalic acid, phosphites, hypophosphites, phosphorous acid, and dithiothreitol.

8. The conductive resin composition of claim 1 , wherein the conductive properties imparting agent is at least one of carbon black, carbon nanotubes, and graphene.

9. The conductive resin composition of claim 1 , wherein the organic complex is Cu chelate of at least one of imidazoles, amines, ethylene diamine tetra acetic acid (EDTA), carboxys, and ureas.

10. A multilayer ceramic capacitor, comprising:
a ceramic element in which a plurality of dielectric layers are stacked;
a plurality of first and second internal electrodes formed on at least one surface of the dielectric layer and respectively alternately exposed through both ends of the ceramic element;
first and second external electrodes formed on both ends of the ceramic element and electrically connected to the first and second internal electrodes;
first and second conductive resin layers formed of a conductive resin composition including epoxy resin, copper powder particles, non-nitrogen-based hardeners, and additives for necking formation and formed on surfaces of the first and second external electrodes; and
first and second plating layers formed on surfaces of the first and second conductive resin layers,
wherein the additives for the necking formation are reducing agents, conductive properties imparting agents, and organic complexes.

11. The multilayer ceramic capacitor of claim 10 , wherein the epoxy resin is added in an amount of 7.5 to 20 wt % based on an amount of copper powder.

12. The multilayer ceramic capacitor of claim 10 , wherein surfaces of the copper powder particles are coated with silver (Ag).

13. The multilayer ceramic capacitor of claim 10 , wherein the first and second plating layers are formed to include a nickel (Ni) plating layer formed on the surfaces of the first and second conductive resin layers and a tin (Sn) plating layer formed on a surface of the nickel plating layer.

Assignees

• Kang Sung Koo
• Park Myung Jun
• Gu Hyun Hee
• Hong Kyung Pyo
• Kim Chang Hoon
• Samsung Electronics Co Ltd

Inventors

• Kang Sung Koo
• Park Myung Jun
• Gu Hyun Hee
• Hong Kyung Pyo
• Kim Chang Hoon

Classifications

• H01G4/2325 Primary

  characterised by the material of the terminals · CPC title

• C08G59/42

  Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof · CPC title

• C08L63/00

  Compositions of epoxy resins; Compositions of derivatives of epoxy resins · CPC title

• H01B1/22 Primary

  the conductive material comprising metals or alloys · CPC title

• C08K2003/085

  Copper · CPC title