Composition for injection molding, sintered compact, and method for producing sintered compact

US9249292B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9249292-B2
Application numberUS-201213688855-A
CountryUS
Kind codeB2
Filing dateNov 29, 2012
Priority dateNov 30, 2011
Publication dateFeb 2, 2016
Grant dateFeb 2, 2016

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  1. Title

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  5. First independent claim

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Abstract

Official abstract text for this publication.

A composition for injection molding includes: an inorganic powder composed of at least one of a metal material and a ceramic material; and a binder containing a polyacetal-based resin and an ethylene-glycidyl methacrylate-based copolymer. In the composition, the ethylene-glycidyl methacrylate-based copolymer is contained in an amount of 1% by mass or more and 30% by mass or less with respect to the amount of the polyacetal-based resin.

First claim

Opening claim text (preview).

What is claimed is: 1. A composition for injection molding, comprising: an inorganic powder composed of at least one of a metal material and a ceramic material; and a binder containing a polyacetal-based resin and an ethylene-glycidyl methacrylate-based copolymer, wherein the ethylene-glycidyl methacrylate-based copolymer is contained in an amount of 1% by mass or more and 30% by mass or less with respect to the polyacetal-based resin; and the polyacetal-based resin is a copolymer of formaldehyde and a comonomer other than formaldehyde. 2. The composition for injection molding according to claim 1 , wherein the composition has: an inner layer composed mainly of the ethylene-glycidyl methacrylate-based copolymer and covering each particle of the inorganic powder, and an outer layer composed mainly of the polyacetal-based resin and located outside the inner layer. 3. The composition for injection molding according to claim 1 , wherein the ethylene-glycidyl methacrylate-based copolymer contains at least one of vinyl acetate and methyl acrylate as a monomer constituting the copolymer. 4. The composition for injection molding according to claim 1 , wherein the softening point of the ethylene-glycidyl methacrylate-based copolymer is 65° C. or higher and 105° C. or lower. 5. The composition for injection molding according to claim 1 , further comprising a saturated fatty acid. 6. The composition for injection molding according to claim 1 , further comprising a wax. 7. A sintered compact, which is produced using the composition for injection molding according to claim 1 . 8. A composition for injection molding, comprising: an inorganic powder composed of at least one of a metal material and a ceramic material; and a binder containing a polyacetal-based resin and an ethylene-glycidyl methacrylate-based copolymer, wherein the ethylene-glycidyl methacrylate-based copolymer is contained in an amount of 1% by mass or more and 30% by mass or less with respect to the polyacetal-based resin; and wherein the composition has an inner layer composed mainly of the ethylene-glycidyl methacrylate-based copolymer and covering each particle of the inorganic powder, and an outer layer composed mainly of the polyacetal-based resin and located outside the inner layer. 9. The composition for injection molding according to claim 8 , wherein the polyacetal-based resin is a copolymer of formaldehyde and a comonomer other than formaldehyde. 10. The composition for injection molding according to claim 8 , wherein the ethylene-glycidyl methacrylate-based copolymer contains at least one of vinyl acetate and methyl acrylate as a monomer constituting the copolymer. 11. The composition for injection molding according to claim 8 , wherein the softening point of the ethylene-glycidyl methacrylate-based copolymer is 65° C. or higher and 105° C. or lower. 12. The composition for injection molding according to claim 8 , further comprising a saturated fatty acid. 13. The composition for injection molding according to claim 8 , further comprising a wax. 14. A composition for injection molding, comprising: an inorganic powder composed of at least one of a metal material and a ceramic material; and a binder containing a polyacetal-based resin and an ethylene-glycidyl methacrylate-based copolymer, wherein the ethylene-glycidyl methacrylate-based copolymer is contained in an amount of 1% by mass or more and 30% by mass or less with respect to the polyacetal-based resin; and wherein the ethylene-glycidyl methacrylate-based copolymer contains at least one of vinyl acetate and methyl acrylate as a monomer constituting the copolymer. 15. The composition for injection molding according to claim 14 , wherein the composition has: an inner layer composed mainly of the ethylene-glycidyl methacrylate-based copolymer and covering each particle of the inorganic powder, and an outer layer composed mainly of the polyacetal-based resin and located outside the inner layer. 16. The composition for injection molding according to claim 14 , wherein the polyacetal-based resin is a copolymer of formaldehyde and a comonomer other than formaldehyde. 17. The composition for injection molding according to claim 14 , wherein the softening point of the ethylene-glycidyl methacrylate-based copolymer is 65° C. or higher and 105° C. or lower. 18. The composition for injection molding according to claim 14 , further comprising a saturated fatty acid. 19. The composition for injection molding according to claim 14 , further comprising a wax.

Assignees

Inventors

Classifications

  • Metallic powder containing lubricating or binding agents; Metallic powder containing organic material · CPC title

  • C08L59/00Primary

    Compositions of polyacetals; Compositions of derivatives of polyacetals (of polyvinyl acetals C08L29/14) · CPC title

  • based on aluminium oxide · CPC title

  • Injection moulding · CPC title

  • Tolerance; Dimensional accuracy · CPC title

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What does patent US9249292B2 cover?
A composition for injection molding includes: an inorganic powder composed of at least one of a metal material and a ceramic material; and a binder containing a polyacetal-based resin and an ethylene-glycidyl methacrylate-based copolymer. In the composition, the ethylene-glycidyl methacrylate-based copolymer is contained in an amount of 1% by mass or more and 30% by mass or less with respect to…
Who is the assignee on this patent?
Seiko Epson Corp
What technology area does this patent fall under?
Primary CPC classification C08L59/00. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Feb 02 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).