Organic film composition, method for forming organic film and patterning process using this, and heat-decomposable polymer

Patent metadata

Field	Value
Publication number	US-9372404-B2
Application number	US-201313873685-A
Country	US
Kind code	B2
Filing date	Apr 30, 2013
Priority date	May 8, 2012
Publication date	Jun 21, 2016
Grant date	Jun 21, 2016

Abstract

The invention provides an organic film composition comprises (A) a heat-decomposable polymer, (B) an organic solvent, and (C) an aromatic ring containing resin, with the weight reduction rate of (A) the heat-decomposable polymer from 30° C. to 250° C. being 40% or more by mass. There can be provided an organic film composition having not only a high dry etching resistance but also an excellent filling-up or flattening characteristics.

First claim

What is claimed is:

1. An organic film composition comprising (A) a heat-decomposable polymer, (B) an organic solvent, and (C) an aromatic ring containing resin, with the weight reduction rate of (A) the heat-decomposable polymer from 30° C. to 250° C. under a helium atmosphere with the temperature raising rate of 10° C./minute being 40% or more by mass, and (A) the heat-decomposable polymer comprises one or more compounds shown by the following general formulae (1a) to (1c),

wherein
R 1a represents an alkyl group having 1 to 4 carbon atoms;
W a represents a saturated or unsaturated divalent hydrocarbon group having 4 to 10 carbon atoms and optionally containing an ether bond;
each of R b1 independently represents —W a —OH, or an optionally substituted, saturated monovalent organic group having 1 to 30 carbon atoms;
R 1c represents a hydrogen atom, an optionally substituted aryl group having 6 to 20 carbon atoms, or a heteroaryl group having 4 to 20 carbon atoms;
each of R c1 independently represents an alkyl group having 1 to 4 carbon atoms, or —W a —OH; and
“n” represents an average number of the repeating unit, and is in the range of 3 to 500.

2. The organic film composition according to claim 1 , wherein (A) the heat-decomposable polymer is in the state of liquid at 100° C. with the weight reduction rate thereof from 30° C. to 250° C. under a helium atmosphere with the temperature raising rate of 10° C./minute being 70% or more by mass.

3. The organic film composition according to claim 1 , wherein (C) the aromatic ring containing resin contains a naphthalene ring.

4. The organic film composition according to claim 3 , wherein (C) the aromatic ring containing resin comprises a resin (C1) that is obtained by polycondensation of any one or more compounds shown by the following general formulae (2a) and (2b) with a compound shown by the following general formula (3),

wherein each of R 2 independently represents a hydrogen atom, or a saturated or unsaturated hydrocarbon group having 1 to 20 carbon atoms; each of R 3 independently represents a benzene ring or a naphthalene ring; each of m1+m2, m3+m4, and m5+m6 represents 1 or 2; each of n1, n2, and n3 represents 0 or 1,
A-CHO  (3)

wherein A represents any of a hydrogen atom, a hydrocarbon group having 1 to 10 carbon atoms, and an optionally substituted aromatic hydrocarbon group having 6 to 20 carbon atoms.

5. The organic film composition according to claim 4 , wherein (C) the aromatic ring containing resin comprises a resin (C2) that has one or more repeating units shown by the following general formula (4),

wherein each of R 4 independently represents a hydrogen atom, or a saturated or unsaturated hydrocarbon group having 1 to 20 carbon atoms; R 5 represents a hydrogen atom or may be bonded with one R 4 to form a ring; when R 4 and R 5 are bonded to form a ring, —R 4 —R 5 — represents a single bond or an alkylene group having 1 to 3 carbon atoms; m7+m8 represents 0, 1, or 2; and n4 represents 0 or 1.

6. The organic film composition according to claim 5 , wherein (C) the aromatic ring containing resin comprises a resin (C3) that is obtained by polycondensation of one or two or more aromatic ring containing compounds with benzophenone, naphthophenone, or fluorenone.

7. The organic film composition according to claim 4 , wherein (C) the aromatic ring containing resin comprises a resin (C3) that is obtained by polycondensation of one or two or more aromatic ring containing compounds with benzophenone, naphthophenone, or fluorenone.

8. The organic film composition according to claim 3 , wherein (C) the aromatic ring containing resin comprises a resin (C2) that has one or more repeating units shown by the following general formula (4),

wherein each of R 4 independently represents a hydrogen atom, or a saturated or unsaturated hydrocarbon group having 1 to 20 carbon atoms; R 5 represents a hydrogen atom or may be bonded with one R 4 to form a ring; when R 4 and R 5 are bonded to form a ring, —R 4 —R 5 — represents a single bond or an alkylene group having 1 to 3 carbon atoms; m7+m8 represents 0, 1, or 2; and n4 represents 0 or 1.

9. The organic film composition according to claim 8 , wherein (C) the aromatic ring containing resin comprises a resin (C3) that is obtained by polycondensation of one or two or more aromatic ring containing compounds with benzophenone, naphthophenone, or fluorenone.

10. The organic film composition according to claim 3 , wherein (C) the aromatic ring containing resin comprises a resin (C3) that is obtained by polycondensation of one or two or more aromatic ring containing compounds with benzophenone, naphthophenone, or fluorenone.

11. The organic film composition according to claim 1 , wherein (C) the aromatic ring containing resin comprises a resin (C1) that is obtained by polycondensation of any one or more compounds shown by the following general formulae (2a) and (2b) with a compound shown by the following general formula (3),

wherein each of R 2 independently represents a hydrogen atom, or a saturated or unsaturated hydrocarbon group having 1 to 20 carbon atoms; each of R 3 independently represents a benzene ring or a naphthalene ring; each of m1+m2, m3+m4, and m5+m6 represents 1 or 2; each of n1, n2, and n3 represents 0 or 1,
A-CHO  (3)

wherein A represents any of a hydrogen atom, a hydrocarbon group having 1 to 10 carbon atoms, and an optionally substituted aromatic hydrocarbon group having 6 to 20 carbon atoms.

12. The organic film composition according to claim 11 , wherein (C) the aromatic ring containing resin comprises a resin (C2) that has one or more repeating units shown by the following general formula (4),

wherein each of R 4 independently represents a hydrogen atom, or a saturated or unsaturated hydrocarbon group having 1 to 20 carbon atoms; R 5 represents a hydrogen atom or may be bonded with one R 4 to form a ring; when R 4 and R 5 are bonded to form a ring, —R 4 —R 5 — represents a single bond or an alkylene group having 1 to 3 carbon atoms; m7+m8 represents 0, 1, or 2; and n4 represents 0 or 1.

13. The organic film composition according to claim 12 , wherein (C) the aromatic ring containing resin comprises a resin (C3) that is obtained by polycondensation of one or two or more aromatic ring containing compounds with benzophenone, naphthophenone, or fluorenone.

14. The organic film composition according to claim 11 , wherein (C) the aromatic ring containing resin comprises a resin (C3) that is obtained by polycondensation of one or two or more aromatic ring containing compounds with benzophenone, naphthophenone, or fluorenone.

15. The organic film composition according to claim 1 , wherein (C) the aromatic ring containing resin comprises a resin (C2) that has one or more repeating units shown by the following general formula (4),

Assignees

• Shinetsu Chemical Co

Inventors

• Watanabe Takeru
• Tachibana Seiichiro
• Fujii Toshihiko
• Noda Kazumi
• Yano Toshiharu
• Kinsho Takeshi

Classifications

• H10P76/20

  of masks comprising organic materials · CPC title

• H10P50/287

  by chemical means · CPC title

• H10P50/283

  by chemical means · CPC title

• H10P50/692

  characterised by their composition, e.g. multilayer masks or materials · CPC title

• H01L21/3081

  Electricity · mapped topic