Seal ring and method for manufacturing seal ring
US-2015342072-A1 · Nov 26, 2015 · US
Adhesive composition, electronic-component-mounted substrate and semiconductor device using the adhesive composition
US9247652B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9247652-B2 |
| Application number | US-68092308-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 2, 2008 |
| Priority date | Oct 3, 2007 |
| Publication date | Jan 26, 2016 |
| Grant date | Jan 26, 2016 |
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- Title
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Abstract
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There are provided are an adhesive composition that keeps storage stability and further gives a cured product wherein metallic bonds are formed in the state that the cured product wets its components and is satisfactorily spread between the components (or parts), thereby turning excellent in adhesive property, electroconductivity, and reliability for mounting such as TCT resistance or high-temperature standing resistance; an electronic-component-mounted substrate using the same; and a semiconductor device. The adhesive composition comprises electroconductive particles (A) and a binder component (B), wherein the electroconductive particles (A) include a metal (a1) having a melting point equal to or higher than the reflow temperature and containing no lead, and a metal (a2) having a melting point lower than the reflow temperature and containing no lead, and the binder component (B) includes a thermosetting resin composition (b1) and an aliphatic dihydroxycarboxylic acid (b2).
First claim
Opening claim text (preview).
The invention claimed is: 1. An adhesive composition, comprising electroconductive particles (A) and a binder component (B), wherein the electroconductive particles (A) comprise a metal (a1) having a melting point equal to or higher than a reflow temperature and containing no lead, and a metal (a2) having a melting point lower than the reflow temperature and containing no lead, and the binder component (B) comprises a thermosetting resin composition (b1) and an aliphatic dihydroxycarboxylic acid (b2), wherein the thermosetting resin composition (b1) comprises an epoxy resin, and the aliphatic dihydroxycarboxylic acid (b2) is an aliphatic dihydroxycarboxylic acid represented by the following general formula (1): wherein R 1 is an alkyl group which may have a substituent, and n and m are each an integer of 0 to 5, and wherein the content of the aliphatic dihydroxycarboxylic acid (b2) is 0.1 part or more by weight and 20 parts or less by weight for 100 parts by weight of the metal (a2) having the melting point lower than the reflow temperature and containing no lead. 2. The adhesive composition according to claim 1 , wherein the reflow temperature is a temperature for mounting with SnAgCu cream solder. 3. The adhesive composition according to claim 1 , wherein the reflow temperature is 260° C. 4. The adhesive composition according to claim 1 , wherein the epoxy resin is an epoxy resin derived from bisphenol F. 5. The adhesive composition according to claim 1 , wherein the metal (a1) having the melting point equal to or higher than the reflow temperature and containing no lead is silver-coated copper powder, and the metal (a2) having the melting point lower than the reflow temperature and containing no lead is Sn42-Bi58. 6. An electronic-component-mounted substrate having a structure wherein a substrate and an electronic component are bonded to each other through the adhesive composition as recited in claim 1 . 7. A semiconductor device having a structure wherein a semiconductor element and a semiconductor-element-mounting supporting member are bonded to each other through the adhesive composition as recited in claim 1 . 8. An electronic-component-mounted substrate having a structure wherein a substrate and an electronic component are bonded to each other through the adhesive composition as recited in claim 2 . 9. A semiconductor device having a structure wherein a semiconductor element and a semiconductor-element-mounting supporting member are bonded to each other through the adhesive composition as recited in claim 2 .
Assignees
Inventors
Classifications
Antistatic agents · CPC title
between a chip and a stacked discrete passive device, e.g. resistors, capacitors or inductors · CPC title
between a chip and a stacked insulating package substrate, interposer or RDL · CPC title
relative to the surface, e.g. recessed, protruding · CPC title
characterised by changes in properties of the bump connectors during connecting · CPC title
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- What does patent US9247652B2 cover?
- There are provided are an adhesive composition that keeps storage stability and further gives a cured product wherein metallic bonds are formed in the state that the cured product wets its components and is satisfactorily spread between the components (or parts), thereby turning excellent in adhesive property, electroconductivity, and reliability for mounting such as TCT resistance or high-temp…
- Who is the assignee on this patent?
- Konno Kaoru, Hayashi Hiroki, Kawamori Takashi, and 1 more
- What technology area does this patent fall under?
- Primary CPC classification B23K35/302. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Jan 26 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).