Semiconductor devices having a seal ring
US-2024413245-A1 · Dec 12, 2024 · US
US9240481B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9240481-B2 |
| Application number | US-201514596291-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 14, 2015 |
| Priority date | Jun 25, 2012 |
| Publication date | Jan 19, 2016 |
| Grant date | Jan 19, 2016 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
A semiconductor device can include an active region having a fin portion providing a channel region between opposing source and drain regions. A gate electrode can cross over the channel region between the opposing source and drain regions and first and second strain inducing structures can be on opposing sides of the gate electrode and can be configured to induce strain on the channel region, where each of the first and second strain inducing structures including a respective facing side having a pair of {111} crystallographically oriented facets.
Opening claim text (preview).
What is claimed is: 1. A semiconductor device, comprising: a pair of strain-inducing patterns formed in a substrate; an active region formed between the pair of strain-inducing patterns, and having an upper surface, a first side surface, and a second side surface opposite the first side surface; and a gate electrode crossing the active region, wherein each of interfaces between the active region and the pair of strain-inducing patterns has {111} surface formed by a directional etching process, and wherein each of the first and second side surfaces has {211} surface, the upper surface has {110} surface, and each of the interfaces is perpendicular to the upper surface. 2. The semiconductor device of claim 1 , wherein each of the interfaces is perpendicular to the first side surface and the second side surface.
Structure · CPC title
Silicon, silicon germanium or germanium · CPC title
characterised by treatments done before the formation of the materials · CPC title
using selective deposition, e.g. simultaneous growth of monocrystalline and non-monocrystalline semiconductor materials · CPC title
of fin field-effect transistors [FinFET] · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.