Integrated heat spreader for multi-chip packages

Patent metadata

Field	Value
Publication number	US-9236323-B2
Application number	US-201313776872-A
Country	US
Kind code	B2
Filing date	Feb 26, 2013
Priority date	Feb 26, 2013
Publication date	Jan 12, 2016
Grant date	Jan 12, 2016

Abstract

An integrated heat spreader comprising a heat spreader frame that has a plurality of openings formed therethrough and a plurality of thermally conductive structures secured within the heat spreader frame openings. The thermally conductive structures can be formed to have various thicknesses which compensate for varying heights between at least two microelectronic devices in a multi-chip package. The thermally conductive structures can be secured in the heat spreader frame by sizing the openings and the thermally conductive structures such that the thermally conductive structures can be secured within the openings without requiring welding or adhesives.

First claim

What is claimed is:

1. An integrated heat spreader, comprising:
a heat spreader frame having a plurality of openings extending from a first surface of the heat spreader frame to a second surface of the heat spreader frame, wherein the plurality of openings each define at least one opening sidewall extending between the heat spreader frame first surface and the heat spreader frame second surface;
a plurality of thermally conductive structures, each having a first surface, an opposing second surface, a least one sidewall extending between the thermally conductive structure first surface and the thermally conductive structure second surface, wherein each of the plurality of thermally conductive structures are secured within a corresponding plurality of openings with the at least one thermally conductive structure sidewall abutting its corresponding at least one heat spreader frame sidewall, and wherein the first surface of each of the plurality of thermally conductive structures are substantially planar to the heat spreader frame first surface; and
wherein the heat spreader frame has a thickness defined between the heat spreader frame first surface and the heat spreader frame second surface; wherein each thermally conductive structure has a thickness defined between its thermally conductive structure first surface and the thermally conductive structure second surface; and wherein the thickness of at least one of the plurality of thermally conductive structures is greater than the thickness of the heat spreader frame.

2. The integrated heat spreader of claim 1 , wherein each of the plurality of thermally conductive structures are secured within a corresponding plurality of openings by pressure between the at least one thermally conductive structure sidewall and its corresponding at least one heat spreader frame sidewall.

3. The integrated heat spreader of claim 1 , wherein each thermally conductive structure has a thickness defined between its thermally conductive structure first surface and the thermally conductive structure second surface; and wherein the thickness of at least one of the plurality of thermally conductive structures is greater than the thickness of another one of the plurality of thermally conductive structures.

4. The integrated heat spreader of claim 1 , wherein a material used for at least one of the plurality of thermally conductive structures differs from a material used for the heat spreader frame.

5. The integrated heat spreader of claim 1 , wherein the heat spreader frame comprises a material selected from the groups consisting of copper, aluminum, stainless steel, and plastic.

6. The integrated heat spreader of claim 1 , wherein at least one of the plurality of thermally conductive structures comprise a material selected from the groups consisting of copper, aluminum, and carbon materials.

7. The integrated heat spreader of claim 1 , wherein at least one of the plurality of thermally conductive structures are substantially cuboid.

Assignees

• Intel Corp

Inventors

• Kourakata Shinobu
• Ogata Kazuo

Classifications

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/877

  Bump connectors and die-attach connectors · CPC title

• H10W70/635

  Through-vias · CPC title

• H10W90/00

  Package configurations · CPC title