Plating catalyst and method

Patent metadata

Field	Value
Publication number	US-9234282-B2
Application number	US-201314090571-A
Country	US
Kind code	B2
Filing date	Nov 26, 2013
Priority date	Dec 14, 2010
Publication date	Jan 12, 2016
Grant date	Jan 12, 2016

Abstract

Stable zero-valent metal compositions and methods of making and using these compositions are provided. Such compositions are useful as catalysts for subsequent metallization of non-conductive substrates, and are particularly useful in the manufacture of electronic devices.

First claim

What is claimed is:

1. A method comprising:
(a) providing a substrate having a plurality of through-holes;
(b) applying a composition comprising 0.5 to 100 ppm of a zero-valent metal, a stabilizer compound and water; wherein the zero-valent metal is selected from the group consisting of palladium, silver, cobalt, nickel, gold, copper and ruthenium; wherein the stabilizer compound has the formula

wherein R═H or (C 1 -C 6 )alkyl; each R 1 is independently selected from the group consisting of H, (C 1 -C 6 )alkyl and Z; Z═(C 2 -C 6 )alkenyl-Z 1 or (CR 2 R 3 ) a Z 1 ; each R 2 and R 3 are independently selected from the group consisting of H, hydroxyl, (C 1 -C 6 )alkyl, hydroxy(C 1 -C 6 )alkyl, C(O)—(C 1 -C 6 )alkyl, (C 1 -C 6 )alkyl-C(O)—(C 1 -C 6 )alkyl, CO 2 R 4 and NR 5 R 6 ; R 4 ═H, (C 1 -C 6 )alkyl, hydroxy(C 1 -C 6 )alkyl or (C 1 -C 4 )alkoxy(C 1 -C 6 )alkyl; R 5 and R 6 are independently selected from the group consisting of H, (C 1 -C 6 )alkyl and (CR 2 R 3 ) a Z 2 ; Z 1 ═C(S)SH, CO 2 H, or C(O)NR 5 R 6 ; Z 2 ═C(O)R 4 or CO 2 R 4 ; and a=0-6; wherein at least one R 1 is Z to the surface of the through-holes; and then
(c) electrolessly depositing a metal on the surface of the through-holes;

wherein the composition has a pH of from >7 to 14; and wherein the composition is free of precipitate for 3 months upon storage at 20° C.

2. The method of claim 1 wherein the pH is 7.5 to 14.

3. The method of claim 1 wherein the zero-valent metal and the stabilizer compound are in a molar ratio of from 1:1 to 1:20.

4. The method of claim 1 wherein Z 1 ═CO 2 H.

5. The method of claim 1 further comprising the step of contacting the surface of the through-holes with an oxidizing agent prior to step (b).

6. The method of claim 1 wherein the metal is selected from the group consisting of copper, nickel, gold, silver and copper/nickel alloys.

7. The method of claim 1 further comprising a step of electrolytically depositing a second metal onto the electrolessly deposited metal of step (c).

8. The method of claim 7 wherein the second metal is selected from the group consisting of copper, copper alloys, tin and tin alloys.

Assignees

• Rohm & Haas Elect Mat

Inventors

• Rzeznik Maria Anna
• Liu Feng

Classifications

• C23C18/405

  Formaldehyde · CPC title

• C23C18/2086

  with use of organic or inorganic compounds other than metals, first · CPC title

• C23C18/1646 Primary

  Characteristics of the product obtained · CPC title

• C23C18/1653

  Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating · CPC title

• H05K3/42

  Plated through-holes {or plated via connections} · CPC title