High speed differential wiring in glass ceramic MCMS

Patent metadata

Field	Value
Publication number	US-9232646-B2
Application number	US-201314102832-A
Country	US
Kind code	B2
Filing date	Dec 11, 2013
Priority date	Nov 22, 2013
Publication date	Jan 5, 2016
Grant date	Jan 5, 2016

Abstract

The embodiments of the present invention relate generally to the fabrication of integrated circuits, and more particularly to a structure and method for fabricating differential wiring patterns in multilayer glass-ceramic (MLC) modules. A structure and method of forming a MLC having layers with staggered, or offset, pairs of lines formed directly on one another are disclosed. In addition, a structure and method of forming a MLC having layers with staggered, or offset, pairs of lines that periodically reverse polarity are disclosed.

First claim

What is claimed is:

1. A method comprising:
forming a glass-ceramic carrier having multiple layers formed directly on top of one another, wherein a first layer contains a first layer left line and a first layer right line, a second layer contains a second layer left line and a second layer right line which are vertically offset from the first layer left line and the first layer right line, and a third layer contains a third layer left line and a third layer right line which are vertically aligned with the first pair of lines, wherein the third layer left line is connected to the first layer right line, wherein the third layer right line is connected to the first layer left line, and wherein the second layer left line and the second layer right line are not connected to any of the first layer left line, the first layer right line, the third layer left line, or the third layer right line.

2. The method of claim 1 , wherein: the first layer left line has a polarity and the first layer right line has an opposite polarity; the second layer left line has the same polarity as the first layer left line and the second layer right line has the same polarity as the first layer right line; and the third layer left line has the same polarity as the first layer left line and the third layer right line has the same polarity as the first layer right line.

3. The method of claim 1 , further comprising:
forming a first contact from an intervening portion of the third layer located between the third layer left line and the third layer right line to an intervening portion of the first layer located between the first layer left line and the first layer right line, through an entire thickness of the second layer, the first contact providing an electrical connection between the third layer right line and the first layer left line which have the same polarity as the second layer right line; and
forming a second contact from the intervening portion of the third layer to the intervening portion of the first layer, through the entire thickness of the second layer, the second contact providing an electrical connection between the third layer left line and the first layer right line which have the same polarity as the second layer left line.

4. A method comprising:
forming a first pair lines on a first greensheet, the first pair of lines comprising a first layer left line and a first layer right line separated by an intervening portion of the first greensheet;
positioning a second greensheet on the first greensheet;
forming a second pair of lines on the second greensheet, the second pair of lines comprising a second layer left line and a second layer right line separated by an intervening portion of the second greensheet, wherein the second layer left line is vertically aligned with the first layer right line;
positioning a third greensheet on the second greensheet;
forming a third pair of lines on the third greensheet, the third pair of lines comprising a third layer left line and a third layer right line separated by an intervening portion of the third greensheet, wherein the third layer left line is vertically aligned with the first layer left line and the third layer right line is vertically aligned with the second layer left line; and
performing a sintering process to harden and join the first greensheet, the second greensheet, and the third greensheet together to form a solid glass-ceramic multilayer carrier, wherein the third layer left line is connected to the first layer right line, wherein the third layer right line is connected to the first layer left line, and wherein the second layer left line and the second layer right line are not connected to any of the first layer left line, the first layer right line, the third layer left line, or the third layer right line.

5. The method of claim 4 , wherein the forming the first pair of lines on the first greensheet, the forming the second pair of lines on the second greensheet, and the forming the third pair of lines on the third greensheet comprises:
depositing a layer of conductive paste on said greensheets in a chosen pattern using a screen printing process.

6. The method of claim 4 , wherein the positioning the second greensheet on the first greensheet and the positioning the third greensheet on the second greensheet comprise:
performing a lamination process to secure and temporarily join said greensheets.

7. The method of claim 4 , wherein the third layer left line has the same polarity as the second layer left line and the first layer left line, and wherein the third layer right line has the same polarity as the second layer right line and the first layer right line.

8. The method of claim 4 , wherein the third layer left line has the same polarity as the second layer left line and the first layer right line, and wherein the third layer right line has the same polarity as the second layer right line and the first layer left line.

9. The method of claim 4 , further comprising:
forming a first layer left contact in the intervening portion of the first greensheet connected to the first layer left line;
forming a first layer right contact in the intervening portion of the first greensheet connected to the first layer right line;
forming a first contact through an entire thickness of the second greensheet, the first contact being vertically aligned with and contacting the first layer left contact;
forming a second contact through the entire thickness of the second greensheet, the second contact being vertically aligned with and contacting the first layer right contact;
forming a third layer left contact through an entire thickness of the third greensheet in the intervening portion of the third greensheet, connected to the third layer left line; the third layer left contact being vertically aligned with and contacting the second contact; and
forming a third layer right contact through an entire thickness of the third greensheet in the intervening portion of the third greensheet, connected to the third layer right line; the third layer right contact being vertically aligned with and contacting the first contact.

10. The method of claim 9 , wherein the forming the first contact, the forming the second contact, the forming the third layer left contact, and the forming the third layer right contact comprises:
forming a via through the entire thickness of said second and third greensheets; and
depositing a layer of conductive paste on said second and third greensheets in a chosen pattern using a screen printing process, the conductive paste filling the via.

11. The method of claim 9 , wherein the forming the first contact through the entire thickness of the second greensheet and the forming the second contact through the entire thickness of the second greensheet comprise:
forming a via through the entire thickness of the second greensheet; and
filling the via with a conductive paste.

12. The method of claim 11 , wherein the forming the via through the entire thickness of the second greensheet comprises:
forming a via hole through the entire thickness of the second greensheet using a punch before positioning the second greensheet on the first greensheet.

Assignees

• IBM

Inventors

• Choi Jinwoo
• Dreps Daniel M
• Mandrekar Rohan U

Classifications

• H10W70/635

  Through-vias · CPC title

• H10W70/098

  Applying pastes or inks, e.g. screen printing (H10W70/095 takes precedence) · CPC title

• H10W70/095

  of vias therein · CPC title

• H10W70/68

  Shapes or dispositions thereof · CPC title

• H10W70/05

  of insulating or insulated package substrates, or of interposers, or of redistribution layers (manufacture or treatment of leadframes H10W70/04) · CPC title