Method for manufacturing piezoelectric transducer
US-2024090333-A1 · Mar 14, 2024 · US
US9229318B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9229318-B2 |
| Application number | US-87004110-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 27, 2010 |
| Priority date | Aug 27, 2010 |
| Publication date | Jan 5, 2016 |
| Grant date | Jan 5, 2016 |
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Official abstract text for this publication.
In various embodiments of the present invention a circuit apparatus having a rounded trace, a method to manufacture the circuit apparatus, and a design structure used in the design, testing, or manufacturing of the circuit apparatus are described. An artwork layer having an adaptable-mask section allows a graded amount of light to pass into an underlying photoresist layer. Subsequent to developing the photoresist layer, the graded amount of light creates a rounded geometric void used as a mold or sidewall for the creation of at least a portion of a rounded trace. The photoresist layer is removed resulting in a circuit apparatus having a rounded trace.
Opening claim text (preview).
The invention claimed is: 1. A circuit apparatus comprising: a photoresist layer applied directly upon a substrate; and an artwork layer directly placed upon the photoresist layer, the artwork layer having at least an adaptable-mask section that allows a graded amount of light to pass therethrough adjacent to and coplanar with at least a continuous-mask section. 2. The circuit apparatus of claim 1 , wherein the adaptable-mask section has one or more attenuated sections. 3. The circuit apparatus of claim 1 , wherein the continuous-mask section allows a similar amount of light to pass therethrough. 4. The circuit apparatus of claim 1 wherein, light passing through first adaptable-mask section penetrates the photoresist layer at a graded depth. 5. A circuit apparatus comprising: a first photoresist layer applied directly upon a substrate; a second photoresist layer applied directly upon the first photoresist layer; and an artwork layer directly placed upon the second photoresist layer, the artwork layer having at least an adaptable-mask section that allows a graded amount of light to pass therethrough adjacent to and coplanar with at least a continuous-mask section. 6. The circuit apparatus of claim 5 wherein the second photoresist layer has one or more oppositely attenuated sections relative to one or more attenuated sections of the first photoresist layer. 7. The circuit apparatus of claim 5 , wherein, light passing through the adaptable-mask section penetrates the second photoresist layer at a graded depth.
using precipitation techniques to apply the conductive material · CPC title
Multiple processes, e.g. applying a further resist layer on an already in a previously step, processed pattern or textured surface · CPC title
with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image · CPC title
Using an artwork, i.e. a photomask for exposing photosensitive layers · CPC title
Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning · CPC title
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