Electrodeposition system and method incorporating an anode having a back side capacitive element
US-2015376812-A1 · Dec 31, 2015 · US
Tin alloy plating solution
US9228269B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9228269-B2 |
| Application number | US-201414201667-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 7, 2014 |
| Priority date | Mar 7, 2013 |
| Publication date | Jan 5, 2016 |
| Grant date | Jan 5, 2016 |
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Abstract
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A cyanide-free tin alloy plating solution having outstanding serial stability as well as a method of precipitating tin alloy plating onto an electroconductive object using the tin alloy plating solution is disclosed. The tin alloy plating solution contains tin ions and one or more additional metal ions of silver, copper, bismuth, indium, palladium, lead, zinc, or nickel, and peptides with cysteine residues.
First claim
Opening claim text (preview).
What is claimed is: 1. A tin alloy plating solution consisting of tin ions, silver ions, metal ions selected from the group consisting of copper ions and bismuth ions, an organic acid or an inorganic acid, optionally one or more additives selected from the group consisting of complexing agents, grain refiners, antioxidants, gloss agents, pH regulators, organic solvents and surfactants, water and peptides with cysteine residues, wherein a range of peptides with cysteine residues are 0.3 to 1.8 times the moles of silver ions. 2. The tin alloy plating solution of claim 1 wherein the peptides with cysteine residues have 2 to 20 amino acid residues. 3. The tin alloy plating solution of claim 1 wherein the peptide with cysteine residues is glutathione. 4. The tin alloy plating solution of claim 1 wherein the plating solution has a pH of not more than 4. 5. A method of depositing tin alloy plating onto an electroconductive object comprising: step (A) contacting an electroconductive object with the tin alloy plating solution of claim 1 ; and step (B) passing a current between electrodes and the electroconductive object to plate the electroconductive object with the tin alloy.
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Classifications
- C25D3/60Primary
containing more than 50% by weight of tin · CPC title
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Frequently asked questions
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- What does patent US9228269B2 cover?
- A cyanide-free tin alloy plating solution having outstanding serial stability as well as a method of precipitating tin alloy plating onto an electroconductive object using the tin alloy plating solution is disclosed. The tin alloy plating solution contains tin ions and one or more additional metal ions of silver, copper, bismuth, indium, palladium, lead, zinc, or nickel, and peptides with cyste…
- Who is the assignee on this patent?
- Rohm & Haas Elect Mat
- What technology area does this patent fall under?
- Primary CPC classification C25D3/60. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Jan 05 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).