Lead-free solder alloy having reduced shrinkage cavities

Patent metadata

Field	Value
Publication number	US-9227258-B2
Application number	US-73662509-A
Country	US
Kind code	B2
Filing date	Apr 23, 2009
Priority date	Apr 23, 2008
Publication date	Jan 5, 2016
Grant date	Jan 5, 2016

Abstract

A lead-free solder alloy having improved surface properties which suppresses minute irregularities and shrinkage cavities has a composition consisting essentially of Ag: 0.1-1.5%, Bi: 2.5-5.0%, Cu: 0.5-1.0%, optionally Ni: 0.015-0.035% and/or at least one of Ge and Ga: 0.0005-0.01%, and a remainder of Sn and unavoidable impurities.

First claim

The invention claimed is:

1. A soldering method comprising applying a solder paste to a printed circuit board, placing a surface mounted electronic part on the solder paste, and carrying out reflow soldering of the solder paste to form a soldered joint which connects the electronic part to the printed circuit board, the solder paste containing a lead-free solder alloy which consists of, in mass %, Ag: 0.3 - 1.5%, Bi: 3.5 - 5%, Cu: 0.5 - 1.0%, Ni: 0.015 - 0.035%, and a remainder of Sn and unavoidable impurities and which has a bonding strength of at least 20 N after 1000 heat cycles from -55° C. to +125° C. for 30 minutes at each temperature.

2. A soldered joint which is formed by applying a solder paste to a printed circuit board, placing a surface mounted electronic part on the solder paste, and carrying out reflow soldering of the solder paste to connect the electronic part to the printed circuit board, the soldered joint being made of a lead-free solder alloy which consists of, in mass %, Ag: 0.3 - 1.5%, Bi: 3.5 - 5%, Cu: 0.5 - 1.0%, Ni: 0.015 - 0.035%, and a remainder of Sn and unavoidable impurities and which has a bonding strength of at least 20 N after 1000 heat cycles from -55° C. to +125° C. for 30 minutes at each temperature.

3. A soldered joint as claimed in claim 2 wherein the solder alloy contains greater than 1.0% to at most 1.5% of Ag.

4. A soldered joint as claimed in claim 2 wherein the solder alloy contains 3.5 - 4.5% of Bi.

5. A soldered joint as claimed in claim 2 wherein the solder alloy contains 0.6 - 0.9% of Cu.

6. A soldered joint as claimed in claim 2 wherein the solder alloy contains 4 - 4.5% of Bi.

7. A method as claimed in claim 1 wherein the solder alloy contains 3.5 - 4.5% of Bi.

8. A method as claimed in claim 1 wherein the solder alloy contains 4 - 4.5% of Bi.

9. A soldered joint as claimed in claim 4 wherein the solder alloy contains greater than 1.0% to at most 1.5% of Ag.

10. A method as claimed in claim 7 wherein the solder alloy contains greater than 1.0% to at most 1.5% of Ag.

11. A soldered joint as claimed in claim 2 wherein the solder alloy has no shrinkage cavities longer than 1 mm in a shrinkage cavity test.

12. A soldered joint as claimed in claim 11 wherein in the shrinkage cavity test, the solder alloy is placed on a circular region of a copper plate measuring 10 mm in diameter and exposed to 270° C. for 30 seconds to melt the solder alloy and then cooled in air to solidify the solder alloy, and the length of shrinkage cavities on the surface of the solidified solder alloy is measured in a region measuring 25 mm 2 at the center of the solidified solder alloy.

13. A method as claimed in claim 1 wherein the solder alloy has no shrinkage cavities longer than 1 mm in a shrinkage cavity test.

14. A method as claimed in claim 13 wherein in the shrinkage cavity test, the solder alloy is placed on a circular region of a copper plate measuring 10 mm in diameter and exposed to 270° C. for 30 seconds to melt the solder alloy and then cooled in air to solidify the solder alloy, and the length of shrinkage cavities on the surface of the solidified solder alloy is measured in a region measuring 25 mm 2 at the center of the solidified solder alloy.

Assignees

• Kawamata Yuji
• Ueshima Minoru
• Kang Min
• Nakagawa Kayako
• Kokubu Yasuaki
• Senju Metal Industry Co

Inventors

• Kawamata Yuji
• Ueshima Minoru
• Kang Min
• Nakagawa Kayako
• Kokubu Yasuaki

Classifications

• H10W90/701

  characterised by the relative positions of pads or connectors relative to package parts · CPC title

• H10W72/20

  Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps · CPC title

• B23K35/362

  Selection of compositions of fluxes (B23K35/365, B23K35/368 take precedence) · CPC title

• B23K35/262

  Sn as the principal constituent · CPC title

• H01L23/49816

  Electricity · mapped topic