P-type metal oxide semiconductor material and method for fabricating the same

US9224599B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9224599-B2
Application numberUS-201414576401-A
CountryUS
Kind codeB2
Filing dateDec 19, 2014
Priority dateDec 31, 2013
Publication dateDec 29, 2015
Grant dateDec 29, 2015

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  1. Title

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  2. Abstract

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  5. First independent claim

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Abstract

Official abstract text for this publication.

A P-type metal oxide semiconductor material is provided. The P-type metal oxide semiconductor material has a formula of In (1−3) Ga (1−b) Zn (1+a+b) O 4 , wherein 0≦a≦0.1, 0≦b≦0.1, and 0<a+b≦0.16. In particular, the P-type metal oxide semiconductor material has a hole carrier concentration of between 1×10 11 cm −3 and 5×10 18 cm −3 .

First claim

Opening claim text (preview).

What is claimed is: 1. A P-type metal oxide semiconductor material having a formula of: In (1−a) Ga (1−b) Zn (1+a+b) O 4 wherein 0≦a≦0.1, 0≦b≦0.1, and 0<a+b≦0.16, and wherein the P-type metal oxide semiconductor material has a hole carrier concentration of between 1×10 11 cm −3 and 5×10 18 cm −3 . 2. The P-type metal oxide semiconductor material as claimed in claim 1 , wherein 0<a≦0.1, and b=0. 3. The P-type metal oxide semiconductor material as claimed in claim 1 , wherein 0<b≦0.1, and a=0. 4. A method for fabricating a P-type metal oxide semiconductor material, comprising: adding an indium salt, a gallium salt, and a zinc salt into a solvent, obtaining a mixture; adding a chelating agent into the mixture, forming an indium-gallium-zinc—containing metal complex; and subjecting the metal complex to a thermal treatment to form P-type metal oxide semiconductor material, wherein the P-type metal oxide semiconductor material has a formula of: In (1−a) Ga (1−b) Zn (1+a+b) O 4 wherein, 0≦a≦0.1, 0≦b≦0.1, and 0<a+b≦0.16. 5. The method for fabricating a P-type metal oxide semiconductor material as claimed in claim 4 , wherein the molar ratio of indium to zinc is between 0.9:1.1 and 1:1.001 in the mixture. 6. The method for fabricating at P-type metal oxide semiconductor material as claimed in claim 4 , wherein, the molar ratio of gallium to zinc is between 0.9:1.1 and 1:1.001 in the mixture. 7. The method for fabricating a P-type metal oxide semiconductor material as claimed in claim 4 , wherein the indium salt comprises indium sulfate, indium chloride, indium nitrate, indium hydroxide, indium citrate, indium acetate, indium acetylacetonate, or a combination thereof. 8. The method for fabricating a P-type metal oxide semiconductor material as claimed in claim 4 , wherein the a gallium salt comprises gallium sulfate, gallium chloride, gallium nitrate, gallium hydroxide, gallium citrate, gallium acetate, gallium acetylacetonate, or a combination thereof. 9. The method for fabricating a P-type metal oxide semiconductor material as claimed in claim 4 , wherein the zinc salt comprises zinc sulfate, zinc chloride, zinc nitrate, zinc hydroxide, zinc citrate, zinc acetate, zinc acetylacetonate, or a combination thereof. 10. The method for fabricating a P-type metal oxide semiconductor material as claimed in claim 4 , wherein the chelating agent comprises tartaric acid, citric acid, malic acid, glycolic acid, gluconic acid, heptogluconic acid, ethylenediaminetetraacetic acid, diethylenetriaminetetraacetic acid, or a combination thereof. 11. The method for fabricating a P-type metal oxide semiconductor material as claimed in claim 4 , wherein the thermal treatment is a sintering process. 12. The method for fabricating a P-type metal oxide semiconductor material claimed in claim 4 , further comprising: performing a ceramic process to manufacture bulks or targets of the P-type metal oxide semiconductor material. 13. The method for fabricating a P-type metal oxide semiconductor material as claimed in claim 12 , wherein the ceramic process comprises a compression molding, injection molding, cold isostatic press, or slip casting.

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Classifications

  • being oxide semiconductor materials (Group IIB-VIA semiconductor materials H10P14/3424) · CPC title

  • Oxides · CPC title

  • using solutions · CPC title

  • characterised by treatments done after the formation of the materials · CPC title

  • P-type · CPC title

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What does patent US9224599B2 cover?
A P-type metal oxide semiconductor material is provided. The P-type metal oxide semiconductor material has a formula of In (1−3) Ga (1−b) Zn (1+a+b) O 4 , wherein 0≦a≦0.1, 0≦b≦0.1, and 0<a+b≦0.16. In particular, the P-type metal oxide semiconductor material has a hole carrier concentration of between 1×10 11 cm −3 and 5×10 18 cm −3 .
Who is the assignee on this patent?
Ind Tech Res Inst
What technology area does this patent fall under?
Primary CPC classification H10P14/3444. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Dec 29 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).