Systems and methods for high-speed data transmission across an electrical isolation barrier
US-12161290-B2 · Dec 10, 2024 · US
High frequency module
US9220164B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9220164-B2 |
| Application number | US-201414489555-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 18, 2014 |
| Priority date | Jan 28, 2014 |
| Publication date | Dec 22, 2015 |
| Grant date | Dec 22, 2015 |
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- Title
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Abstract
Official abstract text for this publication.
A high frequency module includes a ground mounting electrode connected to a ground terminal of a component, a first ground in-plane conductor in a multilayer substrate on a portion under the component and connected to the ground mounting electrode with a first ground interlayer connecting conductor, a signal mounting electrode connected to a signal terminal of the component, and a signal in-plane conductor provided in the multilayer substrate on a portion under the first ground in-plane conductor and connected to the specific signal mounting electrode with a signal interlayer connecting conductor. The first ground in-plane conductor is between the component and the signal in-plane conductor, and the signal interlayer connecting conductor is on an outer side portion of the first ground in-plane conductor when seen from above.
First claim
Opening claim text (preview).
What is claimed is: 1. A high frequency module comprising: a multilayer substrate on which a component is mounted on an upper surface thereof; a ground mounting electrode located on the upper surface of the multilayer substrate and connected to a ground terminal of the component; a flat plate-shaped first ground in-plane conductor located on or in the multilayer substrate on a portion under the component and connected to the ground mounting electrode with a first ground interl…
Assignees
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Classifications
Electricity · mapped topic
- H05K1/0243Primary
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9220164B2 cover?
- A high frequency module includes a ground mounting electrode connected to a ground terminal of a component, a first ground in-plane conductor in a multilayer substrate on a portion under the component and connected to the ground mounting electrode with a first ground interlayer connecting conductor, a signal mounting electrode connected to a signal terminal of the component, and a signal in-pla…
- Who is the assignee on this patent?
- Murata Manufacturing Co
- What technology area does this patent fall under?
- Primary CPC classification H05K1/0243. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Dec 22 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).