High-frequency module

Patent metadata

Field	Value
Publication number	US-9166285-B2
Application number	US-201313863479-A
Country	US
Kind code	B2
Filing date	Apr 16, 2013
Priority date	May 7, 2012
Publication date	Oct 20, 2015
Grant date	Oct 20, 2015

Abstract

A high-frequency module includes a switch IC and a matching circuit. The high-frequency module includes a multilayer body. The switch IC and an inductor of the matching circuit are mounted on a top surface of the multilayer body. A top-surface land electrode on which a common terminal of the switch IC is mounted is connected to one end of a wiring conductor through a via-conductor. The other end of the wiring conductor is connected to a top-surface land electrode on which a terminal electrode at one end of the inductor is mounted, through a via-conductor. An end portion of the inductor on the side connected to the common terminal of the switch IC is disposed near the common terminal. Thus, the length of the wiring conductor is shortened and a parasitic capacitance is decreased.

First claim

What is claimed is:

1. A high-frequency module comprising:
an antenna connection terminal which is connected to an antenna;
a plurality of input/output terminals to which communication signals are input or from which communication signals are output, respectively;
a switch IC that includes a plurality of switch terminals which are individually connected to the plurality of input/output terminals, and a common terminal which is connected to the antenna connection terminal, and…

Assignees

• Murata Manufacturing Co

Inventors

• Uejima Takanori

Classifications

• H01Q1/50 Primary

  Electricity · mapped topic

• H05K1/0243

  Electricity · mapped topic

• H05K2201/09227

  Electricity · mapped topic

• H05K1/025

  Electricity · mapped topic

• H04B1/18

  Electricity · mapped topic