Breaking-in and cleaning method and apparatus for wafer-cleaning brush
US-2024066566-A1 · Feb 29, 2024 · US
US9214331B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9214331-B2 |
| Application number | US-201113309070-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 1, 2011 |
| Priority date | Jan 6, 2011 |
| Publication date | Dec 15, 2015 |
| Grant date | Dec 15, 2015 |
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DIW in an excessively cooled state is supplied as a solidification liquid to a substrate W, and a solidified material of the DIW is formed by a landing impact on the substrate W. This makes the use of a gaseous refrigerant necessary to form a solidified material unnecessary, eliminates the need for a facility to generate the gaseous refrigerant, shortens a processing time and further enables running cost and the like to be suppressed.
Opening claim text (preview).
What is claimed is: 1. A substrate processing method, comprising: a preparation step of preparing a solidification liquid to be supplied to a substrate in a supercooled liquid state; a solidified material forming step of supplying the solidification liquid prepared in the preparation step to the substrate via a space and forming a solidified material of the solidification liquid on the substrate; and a removing step of removing the solidified material of the solidification liq…
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