Substrate treatment apparatus and substrate treatment method

Patent metadata

Field	Value
Publication number	US-9202724-B2
Application number	US-62166309-A
Country	US
Kind code	B2
Filing date	Nov 19, 2009
Priority date	Nov 20, 2008
Publication date	Dec 1, 2015
Grant date	Dec 1, 2015

Abstract

Provided is a substrate treatment apparatus that treats a surface of a substrate while rotating the substrate. The substrate treatment apparatus includes: a physical tool unit including a physical tool configured to treat the surface of the substrate; a nozzle unit including a liquid supply nozzle configured to supply a liquid to the surface of the substrate and a gas supply nozzle configured to supply a gas to the surface of the substrate; a physical-tool-unit moving mechanism configured to move the physical tool unit along the surface of the substrate; and a nozzle-unit moving mechanism configured to move the nozzle unit along the surface of the substrate.

First claim

What is claimed is:

1. A substrate treatment apparatus that treats a surface of a substrate while rotating the substrate, the substrate treatment apparatus comprising:
a physical tool unit including a physical tool configured to treat the surface of the substrate;
a nozzle unit including a liquid supply nozzle configured to supply a liquid to the surface of the substrate and a gas supply nozzle configured to supply a gas to the surface of the substrate;
a physical-tool-unit moving mechanism configured to move the physical tool unit along the surface of the substrate;
a nozzle-unit moving mechanism configured to move the nozzle unit along the surface of the substrate;
a nozzle head casing in which the physical tool unit, the nozzle unit, the physical-tool-unit moving mechanism, and the nozzle-unit moving mechanism are mounted;
a nozzle-head-casing moving unit configured to move the nozzle head device relative to the surface of the substrate; and
a controller configured to control
the physical-tool-unit moving mechanism to linearly move the physical tool unit along the surface of the substrate,
the nozzle-unit moving mechanism to linearly move the nozzle unit synchronized with the physical tool unit along the surface of the substrate in a direction opposite to a direction in which the physical tool unit is linearly moved thereby passing the physical tool unit and the nozzle unit in an antiparallel direction,
the physical tool unit configured to treat the surface of the substrate and the nozzle unit configured to supply the liquid to the surface of the substrate at a same time under a condition that the substrate is rotating, and
the physical tool unit configured to treat a position on the surface of the substrate different from a position that the nozzle unit is supplying the liquid.

2. The substrate treatment apparatus according to claim 1 , wherein
the nozzle-head-casing moving unit includes:
a vertical movement unit configured to move the nozzle head device upwards and downwards in a direction parallel to a direction in which a rotating center axis of the substrate extends; and
a rotation support unit configured to swing the nozzle head casing over the substrate.

3. The substrate treatment apparatus according to claim 1 , wherein
the physical-tool-unit moving mechanism includes a motor and a feed screw configured to be rotated by the motor to move the physical tool unit, and
the nozzle-unit moving mechanism includes a motor and a feed screw configured to be rotated by the motor to move the nozzle unit in synchronization with the movement of the physical tool unit.

4. The substrate treatment apparatus according to claim 1 , wherein the nozzle-unit moving mechanism linearly moves the nozzle unit in a direction opposite to a direction in which the physical tool unit is linearly moved.

5. A substrate treatment method for treating a surface of a substrate while rotating the substrate, the substrate treatment method comprising:
mounting a physical tool unit, a nozzle unit, a physical-tool-unit moving mechanism, and a nozzle-unit moving mechanism in a nozzle head casing, the physical tool unit including a physical tool configured to treat the surface of the substrate, the nozzle unit including a liquid supply nozzle configured to supply a liquid to the surface of the substrate and a gas supply nozzle configured to supply a gas to the surface of the substrate, the physical-tool-unit moving mechanism configured to move the physical tool unit along the surface of the substrate, the nozzle-unit moving mechanism configured to move the nozzle unit along the surface of the substrate;
moving the nozzle head casing relative to the surface of the substrate by a nozzle-head-casing moving unit;
causing the physical-tool-unit moving mechanism to linearly move the physical tool unit along the surface of the substrate;
causing the nozzle-unit moving mechanism to linearly move the nozzle unit synchronized with the physical tool unit along the surface of the substrate in a direction opposite to a direction in which the physical tool unit is linearly moved, thereby passing the physical tool unit and the nozzle unit in an antiparallel direction;
treating the surface of the substrate by the physical tool unit and supplying the liquid to the surface of the substrate by the nozzle unit at a same time under a condition that the substrate is rotating; and
treating, by the physical tool unit, a position on the surface of the substrate different from a position that the nozzle unit is supplying the liquid.

Assignees

• Hayashi Konosuke
• Shibaura Mechatronics Corp

Inventors

• Hayashi Konosuke

Classifications

• H10P72/0424

  using mainly spraying means, e.g. nozzles · CPC title

• H10P72/0412

  using mainly scrubbing means, e.g. brushes · CPC title

• H10P70/20

  Cleaning during device manufacture · CPC title

• H10P72/0414 Primary

  using mainly spraying means, e.g. nozzles · CPC title

• H10P50/00 Primary

  Etching of wafers, substrates or parts of devices · CPC title