Power delivery system with mitigation for radiation induced single event latch-up in microelectronic devices
US-2015370274-A1 · Dec 24, 2015 · US
US9201440B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9201440-B2 |
| Application number | US-201414310731-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 20, 2014 |
| Priority date | Jun 21, 2013 |
| Publication date | Dec 1, 2015 |
| Grant date | Dec 1, 2015 |
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A semiconductor integrated circuit device has, as a current monitor circuit, a circuit in which n-channel type MISFETs are connected in series with each other. Based on a delay time of a speed monitor circuit in a state where a substrate bias is being applied to the p-channel type MISFETs, a first voltage value of a first substrate bias to be applied to the p-channel type MISFETs is determined. Next, based on a current flowing through an n-channel type MISFET in a state where the first substrate bias is being applied to the p-channel type MISFETs of the current monitor circuit and a second substrate bias is being applied to the n-channel type MISFETs of the current monitor circuit, a second voltage value of the second substrate bias to be applied to the n-channel type MISFETs is determined.
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What is claimed is: 1. A semiconductor integrated circuit device, comprising: a first substrate; a p-type first semiconductor region which is formed on a first main surface side of the first substrate and extends in a first direction in the first main surface; an n-type second semiconductor region which is formed on the first main surface side of the first substrate and extends in the first direction in the first main surface; a p-type third semiconductor region which is fo…
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