Wafer inspection interface and wafer inspection apparatus
US-8975904-B2 · Mar 10, 2015 · US
Wafer inspection apparatus
US9201115B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9201115-B2 |
| Application number | US-201113231341-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 13, 2011 |
| Priority date | Sep 13, 2010 |
| Publication date | Dec 1, 2015 |
| Grant date | Dec 1, 2015 |
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- Title
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Abstract
Official abstract text for this publication.
A wafer inspection apparatus includes a first and second wafer transfer mechanisms, an alignment chamber, a second wafer transfer mechanism and a plurality of inspection chambers. The first wafer transfer mechanism is installed at a first transfer area to transfer wafers individually from a housing. The alignment chamber has an alignment mechanism configured to align the wafer at an inspection position for an electrical characteristics inspection. The second wafer transfer mechanism is configured to transfer the wafer through a wafer retaining support in a second transfer area formed along the first transfer area and an alignment area. The plurality of inspection chambers is arranged at an inspection area formed along the second transfer area and is configured to inspect electrical characteristics of the wafer transferred by the second wafer transfer mechanism through the wafer retaining support.
First claim
Opening claim text (preview).
What is claimed is: 1. A wafer inspection apparatus for inspecting electrical characteristics of a wafer by contacting a plurality of electrodes of the wafer with a plurality of probes of a probe card, the wafer inspecting apparatus comprising: a loading mechanism in which housings for receiving a plurality of wafers in wafer loading/unloading area are arranged transversely; a wafer transfer mechanism installed at a transfer area formed along the wafer loading/unloading area to…
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Electricity · mapped topic
Physics · mapped topic
Physics · mapped topic
- G01R31/2887Primary
Physics · mapped topic
- G01R1/073Primary
Physics · mapped topic
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Frequently asked questions
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- What does patent US9201115B2 cover?
- A wafer inspection apparatus includes a first and second wafer transfer mechanisms, an alignment chamber, a second wafer transfer mechanism and a plurality of inspection chambers. The first wafer transfer mechanism is installed at a first transfer area to transfer wafers individually from a housing. The alignment chamber has an alignment mechanism configured to align the wafer at an inspection …
- Who is the assignee on this patent?
- Yamada Hiroshi, Hoshino Takaaki, Kojima Shinji, and 3 more
- What technology area does this patent fall under?
- Primary CPC classification G01R31/2887. Mapped technology areas include Physics.
- When was this patent published?
- Publication date Tue Dec 01 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).