Package substrate and semiconductor package including the same
US-2024429153-A1 · Dec 26, 2024 · US
Electronic component, arrangement and method
US9196554B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9196554-B2 |
| Application number | US-201314043185-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 1, 2013 |
| Priority date | Oct 1, 2013 |
| Publication date | Nov 24, 2015 |
| Grant date | Nov 24, 2015 |
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Abstract
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An electronic component includes at least one semiconductor device and a redistribution board comprising at least two nonconductive layers and a conductive redistribution structure. The semiconductor device is embedded in the redistribution board and electrically coupled to the redistribution structure and the redistribution board has a side face with a step. An outer contact pad of the redistribution structure is arranged on the step.
First claim
Opening claim text (preview).
What is claimed is: 1. An electronic component, comprising: at least one semiconductor device; and a redistribution board comprising at least two nonconductive layers and a conductive redistribution structure, wherein the semiconductor device is embedded in the redistribution board and electrically coupled to the conductive redistribution structure and the redistribution board has a side face facing away from the semiconductor device in a direction parallel to the at least tw…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9196554B2 cover?
- An electronic component includes at least one semiconductor device and a redistribution board comprising at least two nonconductive layers and a conductive redistribution structure. The semiconductor device is embedded in the redistribution board and electrically coupled to the redistribution structure and the redistribution board has a side face with a step. An outer contact pad of the redistr…
- Who is the assignee on this patent?
- Infineon Technologies Austria
- What technology area does this patent fall under?
- Primary CPC classification H10W70/68. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Nov 24 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).