Self-aligned contact metallization for reduced contact resistance
US-9224735-B2 · Dec 29, 2015 · US
US9178117B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9178117-B2 |
| Application number | US-201314057341-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 18, 2013 |
| Priority date | Oct 19, 2012 |
| Publication date | Nov 3, 2015 |
| Grant date | Nov 3, 2015 |
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A light emitting device includes a light emitting structure including a first conductive semiconductor layer, an active layer on the first conductive semiconductor layer, and a second conductive semiconductor layer on the active layer, and an electrode on at least one of the first conductive semiconductor layers or the second semiconductor layer. The electrode includes an adhesive layer on the light emitting structure, a barrier layer on the adhesive layer, and a bonding layer on the barrier layer. The barrier layer includes a plurality of grain boundaries, and the grain boundaries include interstitial elements.
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What is claimed is: 1. A light emitting device comprising: a light emitting structure including a first conductive semiconductor layer, a second conductive semiconductor layer on the first conductive semiconductor layer, and an active layer therebetween, and an electrode on at least one of the first conductive semiconductor layer or the second conductive semiconductor layer, wherein the electrode comprises: an adhesive layer on the light emitting structure; a barrier layer…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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