Semiconductor devices comprising a fin
US-2015028389-A1 · Jan 29, 2015 · US
US9136332B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9136332-B2 |
| Application number | US-201314101715-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 10, 2013 |
| Priority date | Dec 10, 2013 |
| Publication date | Sep 15, 2015 |
| Grant date | Sep 15, 2015 |
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A transistor device and method for forming a field effect transistor device are provided. An example transistor device includes a semiconductor substrate and a device layer. The device layer includes a source region and a drain region that are connected by a channel region that comprises a portion of a nanowire. The channel region is formed by providing a sacrificial layer over the semiconductor substrate. The nanowire is formed over the sacrificial layer, and the sacrificial layer is etched. The etching is selective to the sacrificial layer to prevent the removal of the nanowire, and the etching causes the portion of the nanowire to be suspended over the semiconductor substrate. A gate region is formed that surrounds at least the portion of the nanowire. The gate region is deposited in a conformal manner over all sides of the portion, and the portion is no longer suspended over the semiconductor substrate.
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It is claimed: 1. A method for forming a nanowire field effect transistor (FET) device, the method comprising: growing a sacrificial layer, a nanowire, and a buffer layer in a fin structure over a semiconductor substrate using an epitaxial process, wherein the buffer layer interposes between the semiconductor substrate and the sacrificial layer; forming a dummy gate around at least a portion of the nanowire, wherein the portion of the nanowire comprises a channel region of a lat…
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