Light emitting device package

Patent metadata

Field	Value
Publication number	US-9172004-B2
Application number	US-201414267358-A
Country	US
Kind code	B2
Filing date	May 1, 2014
Priority date	May 7, 2013
Publication date	Oct 27, 2015
Grant date	Oct 27, 2015

Abstract

A light emitting device package includes a body having a cavity therein and first and second recesses inside the cavity of the body. The first and second electrode layers are provided in the first and second recesses, and a light emitting device is provided on the first and second electrode layers. The first and second bumps are provided under the light emitting device and attached to the first and second recesses.

First claim

What is claimed is:

1. A light emitting device package comprising:
a body having a cavity therein;
first and second recesses inside the cavity in the body;
first and second electrode layers in the first and second recesses;
a light emitting device on the first and second electrode layers;
first and second bumps provided under the light emitting device and attached to the first and second recesses; and
solder pastes filled in the first and second recesses to fix the first and second electrode layers to the light emitting device,
wherein the solder pastes surrounds bottom and side of one of the first and second bumps.

2. The light emitting device package of claim 1 , further comprising:
a first hole connected with the first recess and formed through the body; and
a second hole connected with the second recess and formed through the body,
wherein the first electrode layer is formed in the first hole, and the second electrode layer is formed in the second hole.

3. The light emitting device package of claim 2 , wherein a diameter of at least one of the first and second recesses is greater than a diameter of at least one of the first and second holes.

4. The light emitting device package of claim 2 , wherein the first and second electrode layers extend from the first and second holes, respectively, to a bottom surface of the body.

5. The light emitting device package of claim 1 , wherein a bottom surface of the first bump makes contact with the first electrode layer, and the first recess has a depth equal to a depth of the second recess.

6. A light emitting device package comprising:
a body having a cavity therein;
first and second recesses inside the cavity in the body;
first and second electrode layers in the first and second recesses;
a light emitting device on the first and second electrode layers;
first and second bumps provided under the light emitting device and attached into the first and second recesses; and
solder pastes filled in the first and second recesses to fix the first and second electrode layers to the light emitting device,
wherein the first and second recesses have inner lateral sides inclined with respect to bottom surfaces thereof,
wherein the solder pastes surrounds bottom and side of one of the first and second bumps.

7. The light emitting device package of claim 6 , wherein lower regions of the first and second recesses have diameters greater than diameters of upper regions of the first and second recesses.

8. The light emitting device package of claim 6 , wherein the first and second recesses are provided at the inner lateral sides thereof with a concave-convex pattern.

9. The light emitting device of claim 8 , wherein the concave-convex pattern comprises a concave pattern and a convex pattern.

10. The light emitting device package of claim 9 , wherein the concave pattern has a shape recessed outward from the convex pattern.

11. The light emitting device package of claim 9 , wherein the concave-convex pattern has a V shape or a dent shape.

12. A light emitting device package comprising:
a body having a cavity therein;
first and second recesses inside the cavity in the body;
first and second electrode layers in the first and second recesses;
a light emitting device on the first and second electrode layers;
first and second bumps provided under the light emitting device and fixed into the first and second recesses; and
solder pastes filled in the first and second recesses to fix the first and second electrode layers to the light emitting device,
wherein each of the first and second electrode layers includes an electrode support on an outer surface of the body, and an electrode contact part extending from the electrode support while passing through the body,
wherein the solder pastes surrounds bottom and side of one of the first and second bumps.

13. The light emitting device package of claim 12 , wherein the electrode contact part comprises:
a protrusion part protruding upward from the electrode support; and
first and second contact pads branching from the protrusion part.

14. The light emitting device package of claim 13 , wherein the first and second contact pads are formed in the first and second recesses, respectively.

15. The light emitting device package of claim 13 , wherein upper regions of the first and second contact pads are provided at a portion of a bottom surface of the cavity.

16. The light emitting device package of claim 13 , wherein the protrusion part is provided in first and second holes.

17. The light emitting device package of claim 16 , wherein the protrusion part has a lateral side surrounded by the body.

18. The light emitting device package of claim 12 , wherein inner lateral sides of the first and second recesses are inclined with respect to a bottom surface thereof.

19. The light emitting device package of claim 13 , wherein lower regions of the first and second recesses have diameters greater than diameters of upper regions of the first and second recesses.

20. The light emitting device package of claim 2 , wherein the first and second electrode layers include Cu, Al, Cr, Pt, Ti, Au and W.

Assignees

• Lg Innotek Co Ltd

Inventors

• Choi Byeong Kyun
• Seo Jae Won
• Choo Sung Ho

Classifications

• H10W90/726

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W72/20

  Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps · CPC title

• H10H20/8506 Primary

  Containers · CPC title

• H10H20/858

  Means for heat extraction or cooling · CPC title

• H10H20/857

  Interconnections, e.g. lead-frames, bond wires or solder balls · CPC title