Display device, method of manufacturing the display device and carrier substrate for manufacturing display device

Patent metadata

Field	Value
Publication number	US-9166191-B2
Application number	US-201313793932-A
Country	US
Kind code	B2
Filing date	Mar 11, 2013
Priority date	Nov 26, 2012
Publication date	Oct 20, 2015
Grant date	Oct 20, 2015

Abstract

A method of manufacturing a display device includes: preparing a carrier substrate by forming an adhesive layer on a hard glass substrate; forming a flexible substrate on the adhesive layer; forming a thin film transistor and an organic light emitting element on the flexible substrate and encapsulating the organic light emitting element; and separating the carrier substrate and the flexible substrate by irradiating laser light. The adhesive layer is formed on the carrier substrate in such a state that tensile stress is applied. The display device and the carrier substrate are also disclosed.

First claim

What is claimed is:

1. A method of manufacturing a display device, comprising the steps of:
preparing a carrier substrate by forming an adhesive layer on a hard glass substrate;
forming a flexible substrate on the adhesive layer;
forming a thin film transistor and an organic light emitting element on the flexible substrate and encapsulating the organic light emitting element; and
separating the carrier substrate and the flexible substrate by irradiating laser light;
the adhesive layer being formed on the carrier substrate in such a state that tensile stress is applied; and
the adhesive layer being formed of a material including at least one of silicon nitride (SiN x ), silicon dioxide (SiO 2 ), and an amorphous silicon (a-Si), and comprising a tensile stress layer that is formed in such a state that the tensile stress is applied.

2. The method of claim 1 , the adhesive layer being formed of an oxide thin film, and further comprising an auxiliary adhesive layer stacked on the tensile stress layer.

3. The method of claim 2 , the oxide thin film comprising at least one of indium tin oxide (ITO), gallium zinc oxide (GZO), aluminum zinc oxide (AZO), amorphous silicon (a-Si), amorphous indium zinc oxide (a-IZO), titanium indium zinc oxide (TIZO), and gallium indium zinc oxide (GIZO).

4. The method of claim 2 , the auxiliary adhesive layer being formed by using a sputtering method.

5. The method of claim 1 , the flexible substrate being formed of one of a polyimide (PI) varnish and a PI film.

6. The method of claim 1 , further comprising a sacrificial layer disposed between the hard glass substrate and the adhesive layer, the sacrificial layer being removed when the laser light is irradiated.

7. The method of claim 6 , the sacrificial layer comprising at least one of polyimide and silane.

8. The method of claim 1 , at least a portion of the adhesive layer remaining when the carrier substrate and the flexible substrate are separated by irradiating the laser light.

9. A method of manufacturing a display device, comprising the steps of:
preparing a carrier substrate by forming an adhesive layer on a hard glass substrate;
forming a flexible substrate on the adhesive layer;
forming a thin film transistor and an organic light emitting element on the flexible substrate and encapsulating the organic light emitting element; and
separating the carrier substrate and the flexible substrate by irradiating laser light;
the adhesive layer being formed on the carrier substrate in such a state that tensile stress is applied;
said method further comprising the step of curing the carrier substrate and the flexible substrate after forming the flexible substrate on the adhesive layer.

10. The method of claim 9 , tensile stress of the adhesive layer and compressive stress of the flexible substrate and the carrier substrate being offset by each other in the curing step.

11. The method of claim 1 , the adhesive being removed together with the hard glass substrate when the carrier substrate and the flexible substrate are separated by irradiating the laser light.

12. A method of manufacturing a display device, comprising the steps of:
preparing a carrier substrate by forming an adhesive layer on a hard glass substrate;
forming a flexible substrate on the adhesive layer;
forming a thin film transistor and an organic light emitting element on the flexible substrate and encapsulating the organic light emitting element; and
separating the carrier substrate and the flexible substrate by irradiating laser light;
the adhesive layer being formed on the carrier substrate in such a state that tensile stress is applied;
said method further comprising the step of cleansing the adhesive layer before forming the flexible substrate.

13. A carrier substrate, comprising:
a hard glass substrate; and
an adhesive layer that is formed on the hard glass substrate so as to have tensile stress;
the adhesive layer being formed of a material including at least one of silicon nitride (SiN x ), silicon dioxide (SiO 2 ), and an amorphous silicon (a-Si), and comprising a tensile stress layer that is formed so as to have tensile stress.

14. The carrier substrate of claim 13 , the adhesive layer being formed of an oxide thin film, and comprising an auxiliary adhesive layer stacked on the tensile stress layer.

15. The carrier substrate of claim 14 , the oxide thin film comprising at least one of indium tin oxide (ITO), gallium zinc oxide (GZO), aluminum zinc oxide (AZO), amorphous silicon (a-Si), amorphous indium zinc oxide (a-IZO), titanium indium zinc oxide (TIZO), and gallium indium zinc oxide (GIZO).

16. The carrier substrate of claim 13 , further comprising a sacrificial layer formed between the hard glass substrate and the adhesive layer.

17. The carrier substrate of claim 16 , the sacrificial layer comprising at least one of polyimide and silane.

Assignees

• Samsung Display Co Ltd

Inventors

• Yoon Young-Sik

Classifications

• H10P72/7426

  used as a support during build up manufacturing of active devices · CPC title

• H10P72/7412

  the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support · CPC title

• H10P72/744

  Details of chemical or physical process used for separating the auxiliary support from a device or a wafer · CPC title

• H10P72/74 Primary

  using temporarily an auxiliary support · CPC title

• Y10T428/2857

  including metal or compound thereof or natural rubber · CPC title