Substrate processing apparatus and substrate processing method

Patent metadata

Field	Value
Publication number	US-9165798-B2
Application number	US-201213628772-A
Country	US
Kind code	B2
Filing date	Sep 27, 2012
Priority date	Sep 29, 2011
Publication date	Oct 20, 2015
Grant date	Oct 20, 2015

Abstract

A substrate processing apparatus comprises a single-substrate processing apparatus for processing substrates one by one, and an anti-static liquid storage part for storing an anti-static liquid having electrical resistivity maintained at target electrical resistivity higher than the electrical resistivity of an SPM liquid. A plurality of substrates held in a cartridge are immersed in the anti-static liquid inside the anti-static liquid storage part and both main surfaces of the substrate entirely come into contact with the anti-static liquid. From the substrates, static electricity is relatively gently removed. Then, after the static elimination process are finished, a processing liquid supply part supplies the SPM liquid onto an upper surface of the substrate and an SPM process is thereby performed. It is thereby possible to prevent a large amount of electric charges from rapidly moving from the substrate to the SPM liquid and also possible to prevent any damage to the substrate.

First claim

The invention claimed is:

1. A substrate processing apparatus for processing a substrate, comprising:
a substrate holding part for holding a substrate;
a processing liquid supply part for supplying a processing liquid onto a first main surface of the substrate on which a device has been formed in advance, said first main surface being one main surface of said substrate;
an anti-static liquid contacting part for bringing said first main surface of said substrate and a second main surface which is the other main surface thereof into contact with an anti-static liquid having electrical resistivity higher than that of said processing liquid;
a liquid removing part for removing liquid from said substrate by at least one of: drying said substrate, rotating said substrate, and providing another liquid to said substrate; and
a control part configured to control said processing liquid supply part, said anti-static liquid contacting part and said liquid removing part to bring entire said first main surface and said second main surface of said substrate into contact with said anti-static liquid to thereby maintain a wetted state, to then remove said anti-static liquid from said substrate, and subsequently, to supply said processing liquid onto said first main surface of said substrate to thereby perform a process, wherein
said anti-static liquid contacting part configured to said first main surface and said second main surface of said substrate into contact with said anti-static liquid, after said substrate has been subjected to a drying process and thereby electrically charged in advance before being loaded into said substrate processing apparatus.

2. The substrate processing apparatus according to claim 1 , wherein
said anti-static liquid being in contact with said first main surface and said anti-static liquid being in contact with said second main surface are continuous with each other on said substrate.

3. The substrate processing apparatus according to claim 2 , wherein
said anti-static liquid contacting part comprises an anti-static liquid storage part for storing said anti-static liquid therein, and
said substrate is immersed in said anti-static liquid stored in said anti-static liquid storage part to thereby bring said first main surface and said second main surface into contact with said anti-static liquid.

4. The substrate processing apparatus according to claim 3 , wherein
a plurality of substrates which are arranged so that the directions of the normals of respective main surfaces thereof are directed to a horizontal direction are immersed in said anti-static liquid stored in said anti-static liquid storage part.

5. The substrate processing apparatus according to claim 3 , further comprising:
an electrical resistivity setting part for setting target electrical resistivity of said anti-static liquid,
wherein said anti-static liquid is an ionic liquid or deionized water, and
with control by said control part, said first main surface and said second main surface of said substrate are brought into contact with said anti-static liquid while the ion concentration of said anti-static liquid is controlled to maintain the electrical resistivity of said anti-static liquid at said target electrical resistivity.

6. The substrate processing apparatus according to claim 1 , wherein
said anti-static liquid contacting part comprises:
a first anti-static liquid contacting part for supplying said anti-static liquid onto said first main surface of said substrate which is held by said substrate holding part with said first main surface thereof directed upward to thereby puddle entire said first main surface with said anti-static liquid; and
a second anti-static liquid contacting part provided oppositely to said second main surface of said substrate, for discharging said anti-static liquid onto said second main surface to thereby maintain a contact state of entire said second main surface with said anti-static liquid.

7. The substrate processing apparatus according to claim 6 , further comprising:
an electrical resistivity setting part for setting target electrical resistivity of said anti-static liquid,
wherein said anti-static liquid is an ionic liquid or deionized water, and
with control by said control part, said first main surface and said second main surface of said substrate are brought into contact with said anti-static liquid while the ion concentration of said anti-static liquid is controlled to maintain the electrical resistivity of said anti-static liquid at said target electrical resistivity.

8. The substrate processing apparatus according to claim 1 , wherein
said processing liquid is an SPM liquid in which sulfuric acid which is heated and hydrogen peroxide water are mixed, and
said process is an SPM process.

9. The substrate processing apparatus according to claim 1 , further comprising:
an electrical resistivity setting part for setting target electrical resistivity of said anti-static liquid,
wherein said anti-static liquid is an ionic liquid or deionized water, and
with control by said control part, said first main surface and said second main surface of said substrate are brought into contact with said anti-static liquid while the ion concentration of said anti-static liquid is controlled to maintain the electrical resistivity of said anti-static liquid at said target electrical resistivity.

10. The substrate processing apparatus according to claim 9 , wherein
said target electrical resistivity set in said electrical resistivity setting part becomes higher as the size of said device becomes smaller.

11. The substrate processing apparatus according to claim 9 , wherein
said anti-static liquid is said ionic liquid, and
said ionic liquid is a solution in which carbon dioxide is dissolved in deionized water.

12. The substrate processing apparatus according to claim 1 , wherein
said anti-static liquid is a solution in which ammonia is dissolved in deionized water or a solution in which dilute hydrochloric acid is added to deionized water.

13. The substrate processing apparatus according to claim 1 , wherein
said liquid removing part comprises a substrate drying part for performing a drying process on said substrate.

14. The substrate processing apparatus according to claim 1 , wherein
said control part is a programmed computer.

Assignees

• Miyagi Masahiro
• Screen Holdings Co Ltd

Inventors

• Miyagi Masahiro

Classifications

• H10P50/287

  by chemical means · CPC title

• H10P72/0404 Primary

  for general liquid treatment, e.g. etching followed by cleaning · CPC title

• H01L21/31133

  Electricity · mapped topic

• H01L21/67023 Primary

  Electricity · mapped topic