Semiconductor device manufacturing method and semiconductor device manufactured using the same
US-2024395745-A1 · Nov 28, 2024 · US
US9159751B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9159751-B2 |
| Application number | US-201314088793-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 25, 2013 |
| Priority date | Feb 5, 2013 |
| Publication date | Oct 13, 2015 |
| Grant date | Oct 13, 2015 |
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A unit pixel of an image sensor includes a photoelectric conversion region, a floating diffusion region, and a transfer gate. The photoelectric conversion region is in an active region defined by an isolation region of a semiconductor substrate. The photoelectric conversion region generates electric charges corresponding to incident light. The transfer gate transfers the electric charges to the floating diffusion region, which is located in the active region. The transfer gate includes first and second portions divided relative to a reference line, and at least one of the first or second portions does not overlap the isolation region.
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What is claimed is: 1. A unit pixel of an image sensor, the unit pixel comprising: a photoelectric conversion region in an active region defined by an isolation region of a semiconductor substrate, the photoelectric conversion region to generate electric charges corresponding to incident light; a floating diffusion region in the active region; and a transfer gate to transfer the electric charges to the floating diffusion region, the transfer gate adjacent to the photoelectric…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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