Memory interconnect arrangement having high data transfer speed signal integrity

Patent metadata

Field	Value
Publication number	US-9155194-B1
Application number	US-201213535529-A
Country	US
Kind code	B1
Filing date	Jun 28, 2012
Priority date	Jun 28, 2012
Publication date	Oct 6, 2015
Grant date	Oct 6, 2015

Abstract

An arrangement having a processor electrically to, and mounted on, a portion of a surface of a motherboard. A plurality of memory cards is plugged into memory board slot type connectors on a surface of the memory card printed circuit board with the surface of the memory card printed circuit board being perpendicular to the surface of the motherboard. A right angle backplane connector has a first end disposed perpendicular to, and electrically connected to the surface of a motherboard and a second end disposed on the surface of, and electrically connected to, the memory card printed circuit board. The plurality of memory cards is parallel to the surface of the motherboard. An ejector mechanism is provided for removing the memory printed circuit board from an electrical connector receptacle mounted to the motherboard by camming action.

First claim

What is claimed is:

1. An arrangement comprising: a motherboard;
a processor electrically to, and mounted on, a portion of a surface of the motherboard;
a memory card printed circuit board;
a plurality of memory cards plugged into memory board slot type connectors on a surface of the memory card printed circuit board with the surface of the memory card printed circuit board being perpendicular to the surface of the motherboard;
a right angle backplane connector having: a first end disposed perpendicular to, and electrically connected to the surface of the motherboard arid a second end disposed on the surface of, and electrically connected, to, the memory card printed circuit board
wherein the plurality of memory cards are enabled to be suspended by the memory card printed circuit board over portions of the processor while the memory card printed circuit board maintains a position next to the processor;
a heat sink having a base portion disposed over the processor wherein a portion of the heat sink is removed to conform with a shape of the plurality of memory cards.

2. An arrangement comprising:
a motherboard;
a processor electrically to, and mounted on, a portion of a surface of the motherboard;
a memory card printed circuit board;
a plurality of memory board slot type connectors arranged in rows and mounted on, and electrically connected to, a surface of the memory card printed circuit board;
a plurality of memory cards, each one being plugged into a corresponding one of the plurality of memory board slot type connectors;
a right angle backplane connector having;
a first end disposed perpendicular to the surface of the motherboard, the first end being electrically to, and mounted vertically on, a different portion of a surface of the motherboard; and
a second end, disposed at right angles to the first end and disposed on the surface of, and electrically connected to, the memory card printed circuit board;
wherein the surface of the memory card printed circuit board is perpendicular to the surface of the motherboard and the plurality of memory cards is parallel to the surface of the motherboard;
wherein the plurality of memory cards are enabled to be suspended by the memory card printed circuit board over portions of the processor while the memory card printed circuit board maintains a position next to the processor;
a heat sink having a base portion disposed over the processor and having a vertical portion disposed between the distal ends of the first-mention memory card and the distal ends of the second memory cards.

3. The arrangement recited in claim 2 wherein the right angle backplane connector comprises:
electrical wires connected to the memory cards through the memory card printed circuit board and the plurality of memory board slot type connectors, each one being plugged into a corresponding one of plurality of memory board slot type connectors.

4. The arrangement recited in claim 2 including:
a second a memory card printed circuit board;
a second plurality of memory board slot type connectors arranged in rows and mounted on, and electrically connected to, a surface of the second memory card printed circuit board;
a second plurality of memory cards, each one being plugged into a corresponding one of the second plurality of memory board slot type connectors;
a second right angle backplane connector having:
a first end disposed perpendicular to the surface of the motherboard, the first end being electrically to, and mounted vertically on, a second different portion of a surface of the motherboard; and
a second end, disposed at a right angles to the first end of the second right angle backplane connector and disposed on the surface of, and electrically connected to, the memory card printed circuit board;
wherein the surface of the second memory card printed circuit board is perpendicular to the surface of the motherboard and the plurality of memory cards is parallel to the surface of the motherboard; and
wherein the first-mention memory card printed circuit board and the second the memory card printed circuit board are on opposite sides of the processor.

5. The arrangement recited in claim 4 wherein the second plurality of memory cards are suspended by the second memory card printed circuit board over portions of the processor while the second memory card printed circuit board maintains a position next to the processor.

6. The arrangement recited in claim 5 wherein the first-mention memory card printed circuit board and the second the memory card printed circuit board are on opposite sides of the processor.

7. The arrangement recited in claim 6 wherein the first-mention memory cards have distal ends projecting towards distal ends of the second memory cards.

8. The arrangement recited in claim 2 wherein the first end of the a right angle backplane connector has a column of signal pins separated by a column of ground pins; the signal pins in one of the columns have a first signal pin being disposed between a second signal pin and a third signal pin, wherein the motherboard routes the signal pins to the processor through conductors connected to the signal pins; and wherein portions of the conductors connected to the second signal pin and to the third pin are disposed adjacent one another on one side of the column of ground pins and the conductor connected to the first pin is on the other side of the column of ground pins.

9. The arrangement recited in claim 2 wherein the first end of the a right angle backplane connector has a pair strobe pins; the column of the pair of strobe pins being separated from the column of signal pins by a second column of ground pins; wherein the motherboard routes the pair of strobe pins to the CPU through strobe pin conductors connected to the strobe pins, the pair of strobe pin conductors being disposed on the same side of the second column of ground pins.

Assignees

• Sullivan Kenneth M
• Djohan Adrianus
• Giffen Jonathan C
• Feroli Lawrence J
• Phinney John
• Uppala Kranti
• Emc Corp

Inventors

• Sullivan Kenneth M
• Djohan Adrianus
• Giffen Jonathan C
• Feroli Lawrence J
• Phinney John
• Uppala Kranti

Classifications

• H05K1/11 Primary

  Printed elements for providing electric connections to or between printed circuits · CPC title

• H05K1/14

  Structural association of two or more printed circuits (providing electric connection to or between printed circuits H05K1/11, H01R12/00) · CPC title

• H05K1/116 Primary

  Lands, clearance holes or other lay-out details concerning the surrounding of a via · CPC title

• H05K1/141

  One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters (H05K1/142 and H05K1/147 take precedence) · CPC title

• H05K3/366

  substantially perpendicularly to each other (H05K3/361 takes precedence) · CPC title