Electronic device and manufacturing method thereof
US-2024404831-A1 · Dec 5, 2024 · US
US9150758B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9150758-B2 |
| Application number | US-201214007272-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 28, 2012 |
| Priority date | Mar 30, 2011 |
| Publication date | Oct 6, 2015 |
| Grant date | Oct 6, 2015 |
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Official abstract text for this publication.
The polishing composition of the present invention contains an oxidizing agent and a scratch-reducing agent represented by general formula (1) or (2) below. In the formulas, X 1 and X 2 are each independently a hydrogen atom, a hydroxyl group, a carboxyl group, a phosphate group, an alkyl group, an aryl group, an alkyl polyamine group, an alkyl polyphosphate group, an alkyl polycarboxylate group, an alkyl polyaminopolyphosphate group, or an alkyl polyaminopolycarboxylate group.
Opening claim text (preview).
The invention claimed is: 1. A polishing composition used in polishing a surface of an object to be polished that includes a first portion comprised of copper or a copper alloy and a second portion comprised of tantalum, tantalum nitride, a tantalum alloy, titanium, titanium nitride, a titanium alloy, tungsten, tungsten nitride, or a tungsten alloy, the composition comprising an oxidizing agent and a scratch-reducing agent represented by general formula (1) or (2) below,…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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