Rapid Thermal Processing System With Cooling System
US-2024379390-A1 · Nov 14, 2024 · US
US9136115B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9136115-B2 |
| Application number | US-201414493748-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 23, 2014 |
| Priority date | Jun 30, 2009 |
| Publication date | Sep 15, 2015 |
| Grant date | Sep 15, 2015 |
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An object is to manufacture a highly reliable semiconductor device including a thin film transistor with stable electric characteristics. In a method for manufacturing a semiconductor device including a thin film transistor in which an oxide semiconductor film is used for a semiconductor layer including a channel formation region, heat treatment (for dehydration or dehydrogenation) is performed to improve the purity of the oxide semiconductor film and reduce impurities including moisture or the like. After that, slow cooling is performed under an oxygen atmosphere. Besides impurities including moisture or the like exiting in the oxide semiconductor film, heat treatment causes reduction of impurities including moisture or the like exiting in a gate insulating layer and those in interfaces between the oxide semiconductor film and films which are provided over and below the oxide semiconductor and in contact therewith.
Opening claim text (preview).
What is claimed is: 1. A method for manufacturing a semiconductor device comprising the steps of: forming a first electrode over a substrate; forming an insulating film over the first electrode; forming an oxide semiconductor layer over the insulating film; performing a heat treatment on the oxide semiconductor layer in a chamber, whereby a hydrogen concentration of the oxide semiconductor layer is reduced; introducing oxygen into the chamber after the heat treatment; fo…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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