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Processing system for detecting in-situ arcing events during substrate processing
US9129779B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9129779-B2 |
| Application number | US-201213441187-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 6, 2012 |
| Priority date | Jul 7, 2008 |
| Publication date | Sep 8, 2015 |
| Grant date | Sep 8, 2015 |
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Abstract
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A processing system for detecting in-situ arcing events during substrate processing is provided. The processing systems includes at least a plasma processing chamber having a probe arrangement, wherein the probe arrangement is disposed on a surface of the processing chamber and is configured to measure at least one plasma processing parameter. The probe arrangement includes a plasma-facing sensor and a measuring capacitor, wherein the plasma-facing sensor is coupled to a first plate of the measuring capacitor. The probe arrangement also includes a detection arrangement that is coupled to a second plate of the measuring capacitor, wherein the detection arrangement is configured for converting an induced current flowing through the measuring capacitor into a set of digital signals, which is processed to detect the in-situ arcing events.
First claim
Opening claim text (preview).
What is claimed is: 1. A processing system for detecting in-situ arcing events during substrate processing, comprising: at least a plasma processing chamber having a probe arrangement, wherein said probe arrangement is disposed on a surface of said processing chamber and is configured to measure at least one plasma processing parameter, wherein said probe arrangement includes a plasma-facing sensor, and a measuring capacitor, wherein said plasma-facing sensor is coupled to a fi…
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Physics · mapped topic
- H01J37/3299Primary
Electricity · mapped topic
Physics · mapped topic
Physics · mapped topic
Physics · mapped topic
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Frequently asked questions
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- What does patent US9129779B2 cover?
- A processing system for detecting in-situ arcing events during substrate processing is provided. The processing systems includes at least a plasma processing chamber having a probe arrangement, wherein the probe arrangement is disposed on a surface of the processing chamber and is configured to measure at least one plasma processing parameter. The probe arrangement includes a plasma-facing sens…
- Who is the assignee on this patent?
- Booth Jean-Paul, Keil Douglas, Lam Res Corp
- What technology area does this patent fall under?
- Primary CPC classification H01J37/3299. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Sep 08 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).