Method for attaching a flex circuit to a printed circuit board

Patent metadata

Field	Value
Publication number	US-9125331-B2
Application number	US-201213598362-A
Country	US
Kind code	B2
Filing date	Aug 29, 2012
Priority date	Feb 21, 2008
Publication date	Sep 1, 2015
Grant date	Sep 1, 2015

Abstract

Methods and systems for bonding a flex circuit to a printed circuit board (PCB) using an anisotropic conductive film (ACF) bonding process are disclosed. According to one aspect of the present invention, supports may be attached to an electromagnetic interference (EMI) shielding can in such a way that the EMI shielding can is arranged to support and/or spread forces involved in ACF bonding. The supports may be located proximate to the walls of the EMI shielding can, and positioned such that the supports effectively do not come into contact with components mounted on a PCB along with the EMI shielding can.

First claim

The invention claimed is:

1. A method for performing conductive pressure sensitive adhesive (PSA) bonding, the method comprising:
receiving a printed circuit board, the printed circuit board having an electromagnetic interference (EMI) shielding can mounted thereon, the EMI shielding can including at least one wall, wherein the PCB includes at least one support arrangement located proximate to the wall;
receiving a flex circuit;
locating a conductive PSA between the PCB and the flex circuit, wherein the PCB, the flex circuit, and the conductive PSA form a layer stack;
applying a load to the at least one support arrangement, wherein applying the load to the at least one support arrangement causes the load to be applied on a first surface of the layer stack; and
applying heat to a second surface of the layer stack, wherein the pressure and the heat are applied by a plurality of ACF support heads.

2. The method of claim 1 wherein the EMI shielding can is configured to enable the at least one support arrangement to pass therethrough.

3. The method of claim 2 wherein the at least one support arrangement is located proximate to an inner surface of the wall.

4. The method of claim 1 wherein the first surface of the layer stack is associated with the PCB and the second surface of the layer stack is associated with the flex circuit.

5. The method of claim 1 wherein applying the heat to the second surface of the layer stack causes the ACF to bond to the PCB and to the flex circuit.

6. A method for performing conductive pressure sensitive adhesive (PSA) bonding, the method comprising:
receiving a printed circuit board, the printed circuit board having an electromagnetic interference (EMI) shielding can arrangement mounted thereon, the EMI shielding can arrangement including a support structure;
receiving a flex circuit;
locating a conductive PSA between the PCB and the flex circuit, wherein the PCB, the flex circuit, and the conductive PSA form a layer stack;
applying a load to the support structure, wherein applying the load to the support structure causes the load to be applied on a first surface of the layer stack; and
applying heat to a second surface of the layer stack, wherein the pressure and the heat are applied by a plurality of conductive PSA support heads.

7. The method of claim 6 wherein the EMI shielding can arrangement includes a wall that is folded to create the support structure.

8. The method of claim 6 wherein the EMI shielding can arrangement includes a shielding can and a block structure, wherein the block structure forms at least part of the support structure.

9. The method of claim 8 wherein the shielding can is arranged to be at least partially supported by the block structure.

10. The method of claim 8 wherein the EMI shielding can arrangement includes a wall, the wall having a first surface and a second surface, the wall being arranged to be at least partially supported on the block structure such that the first surface is supported on the block structure while the second surface is in contact with the block structure.

11. The method of claim 6 wherein the first surface of the layer stack is associated with the PCB and the second surface of the layer stack is associated with the flex circuit.

12. The method of claim 6 wherein applying the heat to the second surface of the layer stack causes the conductive PSA to bond to the PCB and to the flex circuit.

Assignees

• Yeates Kyle
• Dabov Teodor
• Lynch Stephen Brian
• Apple Inc

Inventors

• Yeates Kyle
• Dabov Teodor
• Lynch Stephen Brian

Classifications

• H05K3/323 Primary

  by applying an anisotropic conductive adhesive layer over an array of pads · CPC title

• H05K2203/0278

  Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive · CPC title

• Y10T29/49126

  Assembling bases · CPC title

• H05K2201/10371

  Shields or metal cases · CPC title

• Y10T156/10

  Methods of surface bonding and/or assembly therefor · CPC title