SiC semiconductor device
US-12080760-B2 · Sep 3, 2024 · US
US9123767B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9123767-B2 |
| Application number | US-201414219709-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 19, 2014 |
| Priority date | Mar 21, 2013 |
| Publication date | Sep 1, 2015 |
| Grant date | Sep 1, 2015 |
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An MOS semiconductor device including an MOS gate structure is disclosed. The MOS semiconductor device includes a p-type well region selectively disposed on the surface layer of an n-type drift layer formed on a semiconductor substrate forming an n-type drain region; an n-type source region selectively disposed on the surface layer of the p-type well region; and a gate electrode placed, via an insulating film, on the surface of a channel formation region on the surface layer of the p-type well region sandwiched between the n-type source region and the surface layer of the n-type drain region, wherein a surface in the channel formation region has a level difference formed in the direction of the peripheral length, and all over the length, of the channel formation region.
Opening claim text (preview).
What is claimed is: 1. A MOS semiconductor device including a MOS gate structure, the MOS semiconductor device comprising: a first conductivity type drain region; a drift region of the first conductivity type that is formed on the drain region; a second conductivity type well region selectively disposed on a surface of the first conductivity type drift region; a source region of the first conductivity type selectively disposed on a surface of the second conductivity type wel…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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