Electronic package module and method for fabrication of the same
US-2024413067-A1 · Dec 12, 2024 · US
Method of handling a thin wafer
US9117828B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9117828-B2 |
| Application number | US-71757310-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 4, 2010 |
| Priority date | Mar 27, 2009 |
| Publication date | Aug 25, 2015 |
| Grant date | Aug 25, 2015 |
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Abstract
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A method of handling a thin wafer includes forming a support structure at the edge of a thinned wafer that is encapsulated by a protection layer. The support structure can be an adhesive layer enclosing the protection layer, a dielectric-filled trench embedded in the thinned wafer and surrounding the protection layer, or a housing affixing the edge of the thinned wafer.
First claim
Opening claim text (preview).
What is claimed is: 1. A method, comprising: providing a wafer having a first surface and a second surface opposite to the first surface; attaching the first surface of the wafer to a carrier, exposing the second surface of the wafer; thinning the wafer from the second surface, forming a thinned wafer; bonding a plurality of dies onto the thinned wafer, wherein each die of the plurality of dies having a first surface and a second surface, and the first surface of each die is…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9117828B2 cover?
- A method of handling a thin wafer includes forming a support structure at the edge of a thinned wafer that is encapsulated by a protection layer. The support structure can be an adhesive layer enclosing the protection layer, a dielectric-filled trench embedded in the thinned wafer and surrounding the protection layer, or a housing affixing the edge of the thinned wafer.
- Who is the assignee on this patent?
- Wu Weng-Jin, Yang Ku-Feng, Chiou Wen-Chih, and 1 more
- What technology area does this patent fall under?
- Primary CPC classification H10W74/014. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Aug 25 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).