Wafer processing method
US-2015357224-A1 · Dec 10, 2015 · US
Semiconductor cleaning device and semiconductor cleaning method
US9117656B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9117656-B2 |
| Application number | US-201213595299-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 27, 2012 |
| Priority date | Dec 19, 2011 |
| Publication date | Aug 25, 2015 |
| Grant date | Aug 25, 2015 |
How to read this patent
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
Filing, priority, publication, and grant dates set the timeline.
- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
Prior art links and similar publications in this corpus.
Abstract
Official abstract text for this publication.
A semiconductor cleaning device includes an external electrode opposed to a side surface of the semiconductor device; a base configured to allow arrangement of the semiconductor device, and having an opening positioned between the side surface of the semiconductor device in the arranged state and the external electrode, and located below the side surface of the semiconductor device; a frame having an electrically insulating property, being in contact with the external electrode, arranged on the base and opposed to the side surface of the semiconductor device; and suction means connected to the opening in the base and being capable of taking in the foreign matter through the opening. Thereby, the semiconductor cleaning device and a semiconductor cleaning method that can remove the foreign matter adhered to the side surface of the semiconductor device and can prevent re-adhesion of the removed foreign matter can be obtained.
First claim
Opening claim text (preview).
What is claimed is: 1. A semiconductor cleaning device for removing foreign matter from a semiconductor device comprising: an external electrode opposed to a side surface of said semiconductor device; a base configured to allow arrangement of said semiconductor device, and having an opening positioned between the side surface of said semiconductor device in the arranged state and said external electrode, and located below the side surface of said semiconductor device; a frame…
Assignees
Inventors
Classifications
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Patent family
Related publications grouped by family.
External sources
Next steps
Free tools are coming soon. Tell us what you want to track and we'll notify you.
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US9117656B2 cover?
- A semiconductor cleaning device includes an external electrode opposed to a side surface of the semiconductor device; a base configured to allow arrangement of the semiconductor device, and having an opening positioned between the side surface of the semiconductor device in the arranged state and the external electrode, and located below the side surface of the semiconductor device; a frame hav…
- Who is the assignee on this patent?
- Okada Akira, Noguchi Takaya, Akiyama Hajime, and 1 more
- What technology area does this patent fall under?
- Primary CPC classification H10P70/30. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Aug 25 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).