Device material for hole injection transport layer, ink for forming hole injection transport layer, device comprising hole injection transport layer, and method for producing the device

US9105859B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9105859-B2
Application numberUS-201013387244-A
CountryUS
Kind codeB2
Filing dateJul 29, 2010
Priority dateJul 31, 2009
Publication dateAug 11, 2015
Grant dateAug 11, 2015

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  2. Abstract

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Abstract

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Disclosed is a device material for a hole injection transport layer. A fluorine-containing organic compound is attached to an organic-transition metal oxide composite which is a reaction product of an organotransition metal complex. Also disclosed are a device and an ink for a hole injection transport layer, the device and ink including the device material each, and a method for producing the device.

First claim

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The invention claimed is: 1. A device material for a hole injection transport layer, comprising: an organic-transition metal oxide composite which is a reaction product of an organotransition metal complex containing at least one kind of transition metal selected from the group consisting of molybdenum and vanadium, with an organic solvent having a carbonyl group and/or hydroxyl group, and a fluorine-containing organic compound attached to the organic-transition metal oxide compos…

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What does patent US9105859B2 cover?
Disclosed is a device material for a hole injection transport layer. A fluorine-containing organic compound is attached to an organic-transition metal oxide composite which is a reaction product of an organotransition metal complex. Also disclosed are a device and an ink for a hole injection transport layer, the device and ink including the device material each, and a method for producing the d…
Who is the assignee on this patent?
Ueno Shigehiro, Okada Masato, Dainippon Printing Co Ltd
What technology area does this patent fall under?
Primary CPC classification H10K50/14. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Aug 11 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).