Light-emitting element package and lighting device having same
US-2024313188-A1 · Sep 19, 2024 · US
US9105829B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9105829-B2 |
| Application number | US-201414211434-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 14, 2014 |
| Priority date | Mar 15, 2013 |
| Publication date | Aug 11, 2015 |
| Grant date | Aug 11, 2015 |
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In accordance with certain embodiments, heat-dissipating elements are integrated with semiconductor dies and substrates in order to facilitate heat dissipation therefrom during operation.
Opening claim text (preview).
What is claimed is: 1. An electronic device comprising: a substrate having first and second conductive traces on a first surface thereof, the first and second conductive traces being separated on the substrate by a gap therebetween; a light-emitting diode (LED) having first and second distinct electrical contacts on a first LED surface thereof, the first and second contacts being attached and electrically coupled to, respectively, the first and second conductive traces; and a…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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