Thermal management in electronic devices with yielding substrates

US9105829B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9105829-B2
Application numberUS-201414211434-A
CountryUS
Kind codeB2
Filing dateMar 14, 2014
Priority dateMar 15, 2013
Publication dateAug 11, 2015
Grant dateAug 11, 2015

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  2. Abstract

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Abstract

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In accordance with certain embodiments, heat-dissipating elements are integrated with semiconductor dies and substrates in order to facilitate heat dissipation therefrom during operation.

First claim

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What is claimed is: 1. An electronic device comprising: a substrate having first and second conductive traces on a first surface thereof, the first and second conductive traces being separated on the substrate by a gap therebetween; a light-emitting diode (LED) having first and second distinct electrical contacts on a first LED surface thereof, the first and second contacts being attached and electrically coupled to, respectively, the first and second conductive traces; and a…

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What does patent US9105829B2 cover?
In accordance with certain embodiments, heat-dissipating elements are integrated with semiconductor dies and substrates in order to facilitate heat dissipation therefrom during operation.
Who is the assignee on this patent?
Tischler Michael A, Cooledge Lighting Inc
What technology area does this patent fall under?
Primary CPC classification H10H20/8582. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Aug 11 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).